Subject: P1394b S100 Honolulu minutes (finally)
From: DickScheel@aol.com
Date: Tue, 16 Sep 1997 04:32:52 -0400 (EDT)

Hi all,

Please accept my most sincere aplogies for the lateness of these minutes.
 I'm afraid I overcommitted when I agreed to take the minutes of the meeting.

Please let me know of any corrections needed.  The actual minutes are from my
notes, which I think are reasonably complete.  However, the attendance list
at the end probably has several errors, since I had to try to read
handwritten information.  I could only partially read several people's
handwriting.

Please send corrections to the reflector, or to me at dicks@lsi.sel.sony.com
(not to my travel email address where this message is sent from).

Regards,
Dick Scheel
Sony

===========================================================

IEEE P1394b Low Speed / Long Distance Task Group
Minutes of meeting 8/7/97 in Honolulu

Taka Fujimori opened the meeting.  All attendees introduced themselves.  Taka
then presented the schedule for the work of this group:

  end 1997:  S400 PHY LSI, S100 UTP, S200 POF, HPCF
  end 1998:  S400 POF, HPCF

Taka also described three models for how 1394-1995 may be connected to long
distance 1394b:

1. DS link --- full PHY in wall plate --- LD 1394b
2. DS link --- full PHY in dongle --- LD 1394b
3. 1394 link chip directly connected to PHY with LD 1394b PMD

The minutes of the previous meeting (July 8, 1997) were presented.  There
were no comments, so they were accepted as written.

Taka presented the agenda (with corrections):

0. Introductions
1. Approval of agenda
2. Review of minutes
3. Action items
  3.1 POF: Nakamura, Taylor, Sagaba
  3.2 PMD (SI) POF S200: Yamazaki
  3.3 PHY coding intensive study, follow-up: Fujimori
  3.4 PHY_DELAY: Fujimori
  3.5 Start-up (beta mode) follow-up: Fujimori
4. New action items
  4.1 Power consumption 3 watts?
  4.2 Root contention
5. Discussion
6. Action items
7. Meeting schedule
   September 2 (Tokyo, hosted be NEC)
8. Adjournment

Kazuki Nakamura gave a presentation about the current state of POF
development.  Current low-NA step index POF has bandwidth > 160 MHz at 100
meters, and transmission loss of 15 dB/100 meters.  Newer graded index POF
preliminary numbers are 1 GHz@100 m and 16 dB/100 m.  An even newer fiber in
development will probably be 400-800 MHz@100 m, <<20 dB/100 m (adjustable by
changing design parameters).  All of these numbers are for 650 nm light.

Ken Taylor presented information on graded index POF.  Characteristics of
current (first generation) and future (second generation) were included.  The
second generation GI POF is still in laboratory development. Preproduction is
expected by the end of 1998.  The second generation GI POF looks like it will
have very constant attenuation vs. wavelength.  Estimated numbers are 10
GHz@100 m, <<10 dB/100 m, for wavelengths <<650 nm through > 1300 nm.

Kazuki Sogabe described Hard Plastic Clad Silica Fiber (HPCF).  This has a
silica (glass) core, covered with a hard polymer cladding for strength.  The
core may be either step index or graded index.  The graded index material is
commercially available.  The high NA and large core diameter (compared to
standard glass fiber) couple efficiently to LED transmitters.  The connector
is simple to assemble, typically taking about three minutes.  Using 650 nm
LEDs, SI can carry S100 over 100 meters and GI can carry S200 over 100 m.
 With 850 nm LEDs, SI can carry S200 for 100 m and GI can carry S400 for 100
m.

Shuntaro Yamazaki presnted a proposed baseline document.  The current text in
this document specifies POF, HPCF, and UTP media, and specifies two types of
optical connectors.  Shuntaro will edit the optical part of this document,
and Taka will edit the UTP part.  Taka asked the task group what their
opinion was of the document.  After some discussion, it was decided that we
need some time to study the document before voting on accepting it.

There was some discussion of the Hyundai 4B/5B patent license staement.

Taka presented some information on PHY delays, comparing 4B/5B with 8B/10B.
 As the group reviewed the chart showing the calculations, a few changes were
determined.  Alistair Coles will do additional analysis of this for the
group, possibly assisted by Jerry Hauck.

Taka presented information on the state machine for 4B/5B beta mode startup.

The next meeting will be September 2 in Tokyo, hosted by NEC.  Details will
be posted to the reflector.

Taka then adjourned the meeting.

Attendees:

Shuntaro Yamazaki	NEC	+81-44-856-2082	yamazaki@ccm.cl.nec.co.jp
Kazuki Nakamura	Mitsubishi Rayon	+81-8275-3-5320	kazuki-n@dtinet.or.jp
Mark Knecht	Phoenix Tech.	408-570-1097	mark_knecht@phoenix.com
Karl Nakamura	LSI Logic	408-433-4516	karln@lsil.com
James Kuo	NSC	408-721-7856	jamesk@galaxy.nsc.com
Kazayuki Abe	NEC	415-528-5904	kabe@sj-pceg.ccgw.nec.com
Phil Young	NEC	44-1908-837247	youngp@euk.nec.co.uk
Peter Teng	NEC	408-588-5555	pteng@mail.com
Bijit Patel	Lucent Tech.	610-712-2188	patelb@bell-labs.com
Tek Wei	Cypress Semi.	408-432-7026	tcw@cypress.com
Hamid Shenavai	Fujitsu		
Farrokh Mottahedin		408-324-7934	fmottahe@qntm.com
Reza Moattar	TDK Semiconductor	714-508-8731	reza.moattar@tsc.tdk.com
Neil Morrow	TI	903-868-5481	nmorrow@ti.com
Davic Brief	NSC	408-721-4985	david.brief@nsc.com
Charles Brill	Amp	717-592-6198	cebrill@amp.com
Jim Busse	NEC	415-528-3810	jimb@ccgate.sj.nec.com
James Gay	Motorola	512-891-2218	jimg@oakhill.sps.mot.com
Michael Nguyen	Fujitsu	408-894-3542	michael.nguyen@fepa.fujitsu.com
Eric Hannah	Intel	408-765-4441	ehannah@mipos2.sc.intel.com
Mike Brown	Intel	602-554-3713	mike_brown@ccm.ch.intel.com
Stan McHann	3Com	408-326-1360	stan_mchann@3com.com
David Wooten	Compaq	281-518-7231	david.wooten@compaq.com
Jerry Hauck	Intel	408-765-5528	jerry_hauck@ccm.sc.intel.com
Tatsuya Arai	Hirose	805-522-7958	tatsuyaa@hiroseusa.com
Kazuki Sogabe	Sumitomo	+81-6-466-5539	dw750134@jnet.sei.co.jp
Dave LaFollette	Intel	408-765-2587	dlafolle@mipos2.sc.intel.com
Harlan Andrews	Apple	408-974-6430	hea@apple.com
Claude Huss	Matsushita	650-237-2366	claude@mew.com
Jack Merrow	Leviton Telcom	425-486-2222	jmerrow@leviton-telcom.com
Dao-Long Chen	Symbios Logic	970-223-5100 x9461	dao-long.chen@symbios.com
Michael Johas Teener	Firefly Inc.	408-461-4901	mike@fireflyinc.com
Ken Taylor	Boston Optical Fiber	508-347-3309	ktaylor@bostonoptical.com
Takahiro Seki	Sony	+81-462-30-6209	seki@lsis.crl.sony.co.jp
Dick Scheel	Sony	408-955-4295	dicks@lsi.sel.sony.com
Kenji Watanabe	Sony	+81-3-5448-5362	nabeken@sslab.sony.co.jp
Yukio Otobe	Fujitsu Lab	+81-44-754-2532	otobe@flab.fujitsu.co.jp
Farrukh Latif	Lucent Technologies	610-712-7546	flatif@lucent.com
Alistair Coles	HP Labs	+44-117-922-8750	anc@hplb.hpl.hp.com
Dan Rausch	HP	408-435-6689	dan_rausch@hp.com
Dave Brunker	Molex	630-527-2622	dbrunker@molex.com
Dave Instone	Xyratex UK	+44-1705-486363	dinstone@uk.xyratex.com
Max Bassler	Molex	630-527-4490	mbassler@molex.com
Swumu Morikura	Panasonic	+81-6-906-4896	morikura@isl.mei.co.jp
Bill Northey	Berg	717-938-2119	northewa@berelect.com
Steve Midford	Intel	408-765-8370	steve_midford@cem.sc.intel.com
David K. Johnson	TI	972-480-3632	dkjohnson@ti.com
Rahoul Puri	Apple	408-974-8598	rahoul@apple.com