Presentation 2/24/97 ATLANTA, GA

by Sunil Chhaya GM-Advanced Technology Vehicles-

POWER ELECTRONICS MODULE INTERFACE STANDARD

PURPOSE OF THIS ACTIVITY

To make the power electronics module interchangeable and interoperable

This will achieve proliferation of sales volume

To provide technological enablers through requirements

This will develop technical capability

To achieve cost reduction over time, as a result of the above

Purpose of this Specification

To set requirements

NOT to invent technology

NOT to help small or big power semiconductor businesses

NOT to dilute the requirements so that EVERYONE can build the module

The specification is only an ENABLER, not a solution

For example, the specification can recommend for cooling system, a clean coolant loop i.e., with particle size <_ microns; Type of cooling medium = ; Sealed System, Flow rate, Pressure Drop, Coolant Inlet Temp and Type of fitting

How Should We Be Doing This?

Divide the specification in workable modules

Everyone work on the SAME aspect of the PEM at any given time as against everyone working on different areas of the spec separately

Work on bulk of the specification OFF-LINE, through frequent meetings

Monthly?

Main working group meetings only for

Progress report sessions

Asking for more inputs from other members

Consensus decisions / draft approval

ARCHITECTURE ISSUES

Functionality and Performance

PEM architecture is defined by purpose

Functionality and performance are functions of PEM architecture

Purpose of PEM is to enable cost reduction through up-integration and packaging, in a manner that will allow PEM to be used as a standard component

Cost reduction and up-integration can be achieved by combining the following functions on the PEM

Power stage (DC in /AC out)

PWM generation and protection

Communication with outside world

Cooling the power stage

Busbars

Integrated passives and isolated sensors?

RATIONALE FOR PROPOSED PEM ARCHITECTURE

COST REDUCTION CAN BE ACHIEVED ONLY THROUGHUP-INTEGRATING FUNCTIONS AND COMPONENTS WITH THE MAXIMUM POTENTIAL FOR COST-REDUCTION

PROPOSED PEM ARCHITECTURE

STRAWMAN SPECIFICATION

FOR

IEEE POWER ELECTRONICS MODULE

Standard and Recommended Practice

Working Group Meeting

APEC '97, Atlanta GA

February 24, 1997

Dr. SUNIL M. CHHAYA, Vice Chairman

IEEE Power Electronics Module Standards Committee

Sr. Project Engineer, Advanced Propulsion Systems

General Motors - Advanced Technology Vehicles

MS 483-619-406,1996 Technology Drive

Troy Ml 48007-7083

Ph: 810 619 9560, Fax: 810 680 5119

email: schhaya@cmsa.gmr.com

STRAWMAN SPECIFICATION FOR

Power Electronics Module

Single integrated package, containing

Power conversion stage, DC input /3 Phase AC

Variable Voltage, Variable Frequency (VVVF) output

Gate drivers for power switches

Gate PWM signal generator, with programmable dead-time

Current limit detection

Temperature detection

Short circuit detection

Out of saturation detection

Functions controlled by on-board microcontroller (m C) or PGA

m C externally programmable

Capable of driving either

AC Induction Motor

Permanent-Magnet DC Brushless Motor

Current loop external to PEM

Integral liquid-cooled heat-sink

Fixed mechanical package and mounting provisions that address

600 V Systems

· IPM 600-50 (600V / 50 kW)

· IPM 600-100 (600V/ 100 kW)

· IPM 600-150 (600V / 150 kW)

· 1200 V Systems

· IPM 1200-50 (1 200V / 50 kW)

· IPM 1200-100 (1200V / 100 kW)

· IPM 1200-150 (i 200V / 150 kW)

1.1 ELECTRICAL INTERFACE SPECIFICATIONS

1.1.1 Electrical Interface Functional Schematic

1.1.2 Electrical Interface Signal Description

1.1.3 Interface Definitions

1.1.3.1 Electrical Interface Definitions- Module IPM600

1.1.3.2 Electrical Interface Definitions- Module IPM1200

1.1.4 Electrical Interface Data Signal Definitions

1.1.4.1.1Serial Data Protocol (PWM_in / STATUS)

1.1.4.1.2 PWM_in Definition

1.1.4.2 STATUS Signal Definition

1.1.5 Electrical Interface EMC Specifications

1.1.5.1 Radiated Immunity

Immunity to Radiated Electric Fields (Bulk Current Injection Method) as per GM91 1 2P (May 1993)

Immunity to Radiated Electromagnetic Fields (Reverberation Method) as per GM9120P (June 1993)

1.1.5.2 Radiated Emissions

As per GM91 1 4P (May 1993)

1.1.5.3 Conducted Immunity (For accessible l/O)

Immunity to Conducted Transients as per GM91 05P (May 1 993)

Immunity to Electrostatic Discharge as per GM91 O9P (May 1993)

Immunity to Jump Start Voltages as per GM91 1 7P (May 1993)

Electrostatic Discharge Sensitivity as per GM91 1 9P (May 1993)

Immunity to Reverse Polarity Jump Start

1.2 MECHANICAL INTERFACE SPECIFICATIONS

1.2.1 Mechanical Interface Schematic

1.2.2 Definitions

1.2.3 Interface Connector Specifications

Type: ___________________________

Number of Pins: ______________16___

Surface Area: _____________________mm2

Current Capability:__________________

Insertion Force: ____________________N

Life: _____________________________Years

Environment: ______________________

Coating Surface:____________________

1.2.4 Shock. Vibration and Drop Specifications

1.2.5 Mass

Maximum Mass =____________________kg

1.3 THERMAL INTERFACE SPECIFICATIONS

1.3.1 Coolant Properties

No coolant contact with internal electrical / electronic part

Corrosion comparable with GM Spec # GM6277M

Fittings are internal to IPM Module

Clog-free passages

Self-purging (air bubbles) at normal flow rate

1.3.2 Thermal Interface Schematic

1.3.3 Coolant Specifications