Original AGENDA:

Review the agenda

Approve the minutes

Review action items

Task leader reports

Tentative Discussion of PCIM Roundtable on Power Module Specs,

Review and generation of action items

Close with next meeting agenda

ACTIVITY:

1. 12:10 Chairman called the meeting to order and thanked everyone for attending.
2. The Chairman reviewed the agenda and asked for a few changes

   Modify the agenda

   Approve the minutes

   Review action items

   Tentative Discussion of PCIM Roundtable on Power Module Specs,

   Refocus Direction and Plan for Rapid Progress

   Review and generation of action items

   Close with next meeting agenda

   These changes were accepted

3. Review and approval of the minutes

   After some time Yuri asked about the next meeting at PCMI, asking about the propriety of having a IEEE standards meeting at an industry funded meeting. Suggesting that IAS meeting a few weeks later would be a better forum.

• Asked to put off discussion until after the minutes had been approved.

Yuri K Also asked about the consideration being given other standards groups at work on related issues and standards developed in the past but currently dormant.

• Jaison Lai is doing this at the committee level but Chairman asked that Yuri try and track down all other activities he has knowledge off and let the working group know about the.

Arthur K moved that the minutes be accepted and B Murty seconded, there were no objections.

4. Reviewed action items

Mark H. WEB PAGE AND NEWSGROUP FOR 1461: The set up of a chat room and better use of the WEB for communication was discussed. Arthur K has volunteered to manage a listserver, and will investigate the ability to have threaded discussions like a newsgroup. Mark H will also look into doing this. Tom Jahn also volunteered to help in this area.

Dennis--MORE MODULE MANFACTURER PATICIPATION: None of the module manufacturers were present. Once more Dennis will try to get them involved, also it is hoped that PCIM and IAS will have more representatives from the module makers so they will attend.

Dennis D. SAE STANDARD Has not been able to get it yet.

Dennis D. Find someone to take charge of the thermal interface issue. Van Godbold was asked to take this on had is now the Task Leader in that area.

5. Jeff F was then asked to talk about a panel discussion he was trying to set up at PCIM 97.

Jeff has asked the organizers of PCIM for a half session period to set up a roundtable to discuss the need for Power Packaging standardization and the work being done in this group. Proposed Format:

• Introduction
• Overview paper discussing the purpose, rationale, progress and timetable of the current effort
• A panel or open forum discussion with the attendees

This was proposed in addition to a meeting of the working group that would be held in the evening.

6. Yuri K and others now asked about the propriety of holding a IEEE standards group meeting at an industry/commercial exhibition/conference. Tom J suggested that informing and promoting was fine but holding the actual meeting might not be a good idea. Others pointed out that the Module Makers will be at the IAS meeting the next month and that maybe holding Jeff F's panel discussion in the PCIM technical session would spark interest in attending a meeting held at IAS. The pro's and con's of PCIM vs IAS were discussed
7. IA--Dennis D will look into the propriety issue for future reference.
8. Arthur K motioned that the next meeting be moved to IAS with support for the panel discussion at PCIM. This was passed and accepted by the majority and there were no objections.

THE NEXT FORMAL MEETING WILL BE AT IAS in NEW ORLEANS SOMETIME DURING THE WEEK OF OCTOBER 5^th.

9. Dennis now moved on to the next item. A discussion of a change in focus/direction

Need to keep the effort general and in support of the industry and users So we probably need to break the effort into smaller pieces and start at a low level.

Probably need to be very mechanical at first and firmly based in current practice.

Break the effort into a series of levels:

Level 0

• Physical Characteristics of the mounting and interconnect
• • Pin size
  • Wire size
  • Bolt pattern
  • Connectors
  • Thermal Interface
    • Liquid Cooled
    • Conduction Cooled

Level 1

• Performance characteristics of the Interface
• • Current density
  • Thermal Impedance
  • Control Signals

Level 2

• Test methods

We need to start a Glossary of Terms with definitions, this will be put up on the WEB and discussed over the listserver system so we have a common terminology to work with in future.

Yuri and Raja then asked some of the questions about Specs. vs Stds. and how we plan to keep this from becoming a specification for one product. And if we had thought about the fact that one size does not fit all. Yuri suggested that we somehow break the application space into zones.

Several people, Arthur, Sunil and Yuri in the main discussed how to break the space into zones. Voltage and box size came up with power, dissipation and current suggested as well. This is an interesting problem, AI Sunil volunteered to try and create a prototype zoning system for group consideration.

• After some discussions on the topic Dennis asked AI Yuri to take the lead in tracking down examples of prior work/specs/standards. Yuri will get them to Mark who will get them on the WEB site.

Now discussed how to break down the workload, in overview there will not be much change.

• Sunil C--Create the zoning system and work with others from the work he has put in on the PNGV power module spec.
• Van G--Thermal Inerface Supported by Anand as well as others
• Jeff F--Mechanical Interface Supported by Jason and Sunil
• Angelo F--Control Interface Supported by Chuan
• John M-- Power Interface Supported by Rob

Denns D emphasized that it would be in everyones interest if we could have Level 0 of one zone ready for the next meeting.

Tom J suggested that from prior experience e-mail and brainstorming like techniques could be used to accelerate a process like this.

• Put in around 4 hours or less on a cut at the problem assigned
• E-mail to everyone in the group and solicit suggestions
• Repeat

Someone suggested that a backbone for the brainstorming be provided in the form of a table of contents. AI Mark H volunteered to take Sunils' strawman and create a generalized table of content and get it out to the members.

B Murty suggested that all our work should be based on existing technology/methods. That we should basically be collecting a database of proven prior art for use in the future. Although there is some issue with looking to the future, for now it was generally agreed that this was the basis for our initial work.

10. A quick review of the action items was held
11. The agenda for the next meeting will be as proposed for this meeting.
12. Dennis D asked for a motion to adjourn it was submitted and seconded and agreed on by acclaim.

THERE WILL BE A DISCUSSION OF OUR WORK AT PCIM 97 IN BALTIMORE

BUT

THE NEXT FORMAL MEETING WILL BE AT THE IAS GENERAL MEETING IN NEW ORLEANS SOMETIME AROUND OCTOBER 6^th

Tentative Schedule of future meetings