Power Electronics Module Interface Working Group (P1461)

Chairman: Mark Harris

Note: Dennis Darcy has changed jobs and Mark Harris was asked to take over the position.

Background: Power electronics circuits are being packaged into modules at higher power densities with internal integration of control electronics. Presently, power electronic modules are designed without compatibility between different manufacturers products. Consequently the development and installation of a power electronics system is difficult and costly. This project is to establish guidelines for power module manufacturers and the user community so that power modules can be interfaced readily and unnecessary re-engineering cost can be avoided. This project is to develop recommended practices for power electronic modules as well as passive support circuitry, so that power modules can be interfaced more readily. The document will specify the way of interconnecting circuit components. The results will enable modular architectures for redundant, scaleable and low-cost systems by using standard building block elements.

Minutes

DRAFT Minutes from the 6th Meeting (PSW97)

Minutes from the 5th Meeting (APEC98)

Minutes from the 4th Meeting (IAS97)

Minutes from 3rd Meeting ( PESC97)

Minutes from 2nd Meeting (APEC97)

Minutes from 1st Meeting (PCIM96)

Working Documents

Draft Table of Contents

Breakdown of Application space into classes (Mark Harris' version)

Glossary/Definitions UPDATED

White Papers

Interconnect Concept (Arthur Kelley)

PNGV Convert Spec (Sunil Chhaya)

EV Module requirements (John Miller)

Control Interface (Angelo Feraro)

IAS97 Automotive Integrated Module (Sunil Chhaya)

Thermal Issues With Standardization (C. Van Godbold)

Other Documents

PAR Images

PCIM Paper

PCIM Presentation

Schedule of meetings

APEC 99 Adams Mark Conference Center, Dallas TX.

The next meeting after that would be at IAS - Oct 3-7, 1999 Phoenix AZ

1461 POC | IEEE Standards Home Page | IEEE Standards e-mail | IEEE Homepage