Notes:

Many TBDs remain

Definitions are needed for many parameters

Section headings are needed to better explain the document flow.

The Application Guidelines need to be better organized

Should parameters that have only definitions be placed in "Definitions" section?

General formatting

 

 

Draft Recommended Practice for Electronic Power Subsystems: Parameters, Interfaces, Elements, and Performances

 

Developed By

Open Systems/Joint Task Force

Air Force Research Laboratory, Wright Patterson Air Force Base

Electronic Power Specification Standardization (insert IEEE header)

 

 

 

 

 

Abstract: The purposegoal of this Recommended Practice is to create avenues to expand the use of Commercial -Item P(CI) electronic power Electronics (CIPE) subsystems and the electronic building blockselements that form them. This document focuses on the definition and characterization of the interfaces between power electronic elements, Th includinge document defines the external interfaces to the electronics, their characterizing parameters, and some examples of the parameters’ performance (available and required to accommodate special applications). The examples of performance found in the Annexes will change The document is companion to IEEE P1515 Recommended Practice for Electronics Power Subsystems: Test Parameters, Test Methods and Test Condition. The information provided changes with the effects of new technologies and in response to input from users and manufacturers. Designers and integrators of power electronics can assess use thise information in to developing achieve cost effective performance.cost and performance effective products. Application Guidance is an experience data basedatabase provided to assist industry with power electronics system design and integration.

 

 

 

 

 

 

 

 

 

 

(Save for presentation materials

Providers Manufacturers of the power electronics can reference thise information document to publish expanded accommodating standardized supplemental data. Integrators of special applications can use this data to select CIPE products, thus thus promoting expanding the usage of CIPE electronics. ) Availability of such data/information would benefit both the industry and the government.

 

 

 

Maintained By

TRW Dayton Avionics Engineering Center

Ed Mabe 937-259-4985

 

 

Replace with IEEE banner

Maintained By

TRW Dayton Avionics Engineering Center

Ed Mabe 937-259-4985

Air Force Research Laboratory, Wright Patterson Air Force Base

Marvin Soraya 937-255-4709 Ext. 4177

Introduction

 

Recommended Practice IEEE Std. 1573-200x is a system level document providing interface definitions and application guidance, which includes some characterizing parameters for power electronics subsystems. This is a companion document to IEEE Std. 1515-2000 (Recommended Practice for Electronic Power Subsystems Parameter Definitions, Test Methods and Test Conditions). It also focuses on the definition and characterization of the interfaces between power electronic elements, including some examples of performance required to accommodate special applications. The Electronic Power Specification Standardization (EPSS) activity is sponsored by the Open System Joint Task Force (OS-JTF) from the Office of the Secretary of Defense. The goal is to reduce system acquisition costs by expanding and enhancing the use of Commercial-Item (CI) resources (products, services, processes, and/or piece parts). EPSS members are drawn from industry (defense and commercial users and manufacturers) and academia. EPSS documents are driven by and are based on industry consensus.

Use of this document

Thise document above structure complements the structure provided by IEEE P1515 (Recommended Practice for Electronic Power Subsystems). Availability and use of these Recommended Practices are intended to benefit the industry (commercial, defense) and the government. Specifically, the use of the Recommended Practices would:

 

  1. enhances product the integrity of product performance data that conform to the Recommended Practices,
  2. promotes product integration success,
  3. encourages suppliers to publish relevant product performance data,
  4. furthers supports the realization of application reuse.the dual-use initiative
  5. facilitates use of commercial products in demanding applications, by recommending ways to adapt such products for use beyond their original application

 

Working Group members are from industry (defense and commercial users and manufacturers) and academia. EPSS documents are driven by and are based on industry consensus. Volunteers from both user and manufacturer communities are developing the Recommended Practice. The data is dynamic (NOTE: this implies frequent updating of the standard after the release of Version 1), responding to technology changes and to the input from users and manufacturers.

 

 

 

 

Table of Contents

1. Overview *

1.1 Scope. *

1.2 Purpose. *

1.3 Organization of the recommended practice *

2. References *

3. Definition of terms and acronyms *

3.1 Acronyms *

3.2 Terms *

4. Power System Architecture - Joe Ortiz/Rich Buck *

4.1 System Element and Architecture Definition move to Power System Architecture - Ernie Parker *

5. Interface Definition - Yan-Fei Liu/ Rick Eddins *

5.1 Electrical Interface. *

5.2 Mechanical Interface *

5.3 Environmental Interface *

5.4 System Effectiveness *

6. Electrical Interface Parameters *

6.1 EMC - Ernest Fierheller *

6.2 Stability *

6.3 Voltage and current *

6.4 Supervisory and control – David Cooper *

6.5 Protection - Carlos Gonzalez *

7. Mechanical Interface *

7.1 Thermal Interface M/D - Harry Lamberth *

7.2 Packaging M/D - David Berry *

8. Environmental *

8.1 Resistance to materials Env/D/M/C - George Schoneman *

8.2 Sand and Dust (corrosion, filters) Env/D/M/C - George Schoneman *

8.3 Explosive Atmosphere Env/D/M/C- George Schoneman *

8.4 Acoustic Susceptibility Env/D/M/C- George Schoneman *

8.5 Acoustic Emissions/Audible Noise (need to include human factors issues) Env/D/M/C- George Schoneman *

8.6 Radiation Env/D/ reference other sources for testing- Christian Lazarovici *

9. System Effectiveness *

9.1 Product Life SE/D/M/C – David Cooper/ Ernie Parker *

9.2 Compliance Information, e.g., Agency Approvals *

9.3 Component Quality *

9.4 Derating app guideline *

9.5 Quality Assurance (was Control) change table 6 item 8 *

9.6 Configuration Management *

9.7 Warranty *

9.8 Test Equipment Calibration and Standards application guide *

9.9 Product Obsolescence vs discontinuance *

9.10 Qualification Requirements *

9.11 Production line final test *

9.12 Acceptance Testing *

9.13 Screening *

10. System Integration & Adaptation *

10.1 System interaction – write as a general guideline - Ernie Parker/David Cooper *

10.2 Supervisory Monitoring and Control and Software Implementation – David Cooper *

10.3 Adaptation *

10.4 Case Studies, Examples *

Annex A: Performance *

Annex B: Parameter Index *

1. Overview 5

1.1 Scope. 5

1.2 Purpose. 5

1.3 Organization of Practice 5

2. References 6

3. Definition of Terms and Acronyms 6

3.1 Acronyms 6

3.2 Terms 8

4. Electrical Interface 10

4.1 EMC 12

4.2 Stability 12

4.3 Voltage and current 13

4.4 Supervisory and control 13

4.5 Protection 13

4.6 14

5. Mechanical Interface 14

5.1 Thermal Interface M/D 14

5.2 Packaging M/D 15

5.3 16

6. Environmental 16

6.1 Resistance to materials Env/D/M/C 16

6.2 Sand and Dust (corrosion, filters) Env/D/M/C 16

6.3 Explosive Atmosphere Env/D/M/C 16

6.4 Acoustic Susceptibility Env/D/M/C 16

6.5 Acoustic Emissions/Audible Noise (need to include human factors issues) Env/D/M/C 16

6.6 Radiation Env/D/ reference other sources for testing 17

7. System Effectiveness 17

7.1 Product Life SE/D/M/C 17

8. Application Guidance 17

8.1 System Element and Architecture Definition 17

8.2 System interaction – write as a general guideline 19

8.3 Supervisory Monitoring and Control and Software Implementation 21

8.4 Accommodation 22

8.5 Input 23

8.6 Output 24

9. Annex 1: Performance 25

10. Annex 2: Parameter Index 42

1. Overview

1.1 Scope.

1.2 Purpose.

1.3 Organization of Practice

2. References

3. Definition of Acronyms and Abbreviations; Entities, Attributes, Parameters; and Terms

3.1 Acronyms and Abbreviations

3.2 Definitions of Power Electronics System (PELS) Interface Entities, Attributes, and Parameters

3.3 Definition of Terms 12

4. Interfaces: Definitions, Test Methods, Test Conditions TBD 14

5. Application Guidance 15

5.1 System Element and Architecture Definition 15

5.2 System interaction – write as a general guideline 17

5.3 Supervisory Monitoring and Control and Software Implementation 19

5.4 Accommodation 20

5.5 Input 21

5.6 Output 21

6. Annex 1: Performance 23

7. Annex 2: Parameter Index 40

1. Overview 2

1.1 Scope. 2

1.2 Purpose. 2

1.3 Organization of Practice 2

2. References 2

3. Definition of Acronyms and Abbreviations; Entities, Attributes, Parameters; and Terms 2

3.1 Acronyms and Abbreviations 2

3.2 Definitions of Power Electronics System (PELS) Interface Entities, Attributes, and Parameters 2

3.3 Definition of Terms 2

4. Interfaces: Definitions, Test Methods, Test Conditions TBD 2

5. Application Guidance 2

5.1 System Element and Architecture Definition 2

5.2 System interaction – write as a general guideline 2

5.3 Supervisory Monitoring and Control and Software Implementation 2

5.4 Accommodation 2

5.5 Input 2

5.6 Output 2

6. Annex 1: Performance 2

7. Annex 2: Parameter Index 2

1. Overview 4

1.1 Scope. 4

1.2 Purpose. 4

1.3 Organization of Practice 5

2. References 5

3. Definition of Terms, Acronyms and Abbreviations 5

3.1 Definition of terms 5

3.2 Acronyms and Abbreviations 7

4. Power Sub-System Interface Parameters 9

4.1 General Power Sub-System Interface Parameters 9

4.2 Electrical Output/Load System Interface 10

4.3 Electrical Source System Interface Parameters 11

4.4 Mechanical System Interface Parameters 11

4.5 Environment System Interface Parameters 14

4.6 System Effectiveness Interface Parameters 14

5. Performance 15

6. Application Guidance 16

6.1 System Element Usage 16

6.2 Architectures 18

6.3 Economic 18

6.4 System interaction – write as a general guideline 18

6.5 Accommodation 22

6.6 Output Noise 22

7. ANNEXES 24

7.1 Performance 24

7.2 Parameter Index 41

 

Table of Contents

1. Overview 1

1.1 Scope. 1

1.2 Purpose. 1

1.3 Organization of Practice 2

2. References 2

3. Definition of Terms, Acronyms and Abbreviations 2

3.1 Definition of terms 2

3.1.1 Commercial Off-The-Shelf (COTS) (from Ensuring Successful …) 2

3.1.2 Commercial Component (from FAR) 3

3.1.3 Commercial Item (excerpted from FAR) 3

3.2 Acronyms and Abbreviations 4

4. Power Sub-System Interface Parameters 6

4.1 General Power Sub-System Interface Parameters 6

4.1.1 Contact Resistance NOTE: Consider Hot Swap ie. max interrupt current vs. max current 6

4.1.2 ESD 7

4.1.3 Status Monitoring 7

4.1.3 Supervisory Control 7

4.1.4 7

4.2 Electrical Output/Load System Interface 8

4.2.1 Regulation, Combined 8

4.2.2 Regulation effects due to aging 8

4.2.3 Set point voltage accuracy 8

4.2.4 Power Density 8

4.2.5 Switching Frequency Variability 8

4.2.6 Synchronization of elements 9

4.2.7 Noise spectrum – EMI 9

4.2.8 Low Voltage Protection 9

4.2.9 Overcurrent characteristics 9

4.2.10 Overtemperature shutdown 9

4.3 Electrical Source System Interface Parameters 9

4.3.1 Reverse Polarity Protection 9

4.4 Mechanical System Interface Parameters 9

4.4.1 Thermal Interface Type – simple definition of type 9

4.4.2 Cooling Provision 9

4.4.3 Conduction Cooling 10

4.4.4 Convection Cooling 10

4.4.5 Airflow 10

4.4.6 Pressure drop/back pressure 10

4.4.7 Temperature Rise 10

4.4.8 Maximum Inlet Temperature 10

4.4.9 Liquid Cooling (closed system) 10

4.4.10 (Heat Pipe) – phase change TBD review table 10

4.4.11 Flow rate 10

4.4.12 Pressure drop 10

4.4.13 Cooling Medium 10

4.4.14 Maximum Power Dissipation 10

4.4.15 Packaging 10

4.4.16 Component 11

4.4.17 Card or Printed Wiring Assembly 11

4.4.18 Card or Printed Wiring Assembly 11

4.4.19 Box 11

4.4.20 Electrical Terminations (for components/PWAs/ Boxes) 11

4.4.21 11

4.4.22 Physical Characteristics fix tableTBD 11

4.4.23 Center of Gravity(CG) 12

4.5 Environment System Interface Parameters 12

4.5.1 Resistance to materials (jet fuel, hydraulic fluid, de-icer, gases, corrosive agents) 12

4.5.2 Sand and dust 12

4.5.3 Explosive atmosphere 12

4.5.4 Combined effects (Many Environments @ once) 12

4.5.5 Acoustic Susceptibility 12

4.5.6 Acoustic Emissions/ audible noise. 12

4.5.7 Radiation 12

4.6 System Effectiveness Interface Parameters 12

4.6.1 Compliance Information, e.g., Agency Approvals 12

4.6.2 Product Life 13

4.6.3 Component Quality 13

4.6.4 Derating 13

4.6.5 Quality Control 13

4.6.6 Configuration Management 13

4.6.7 Warranty TBD what is diff between waranty and guarantee 13

4.6.8 Test Equipment Calibration and Standards 13

4.6.9 Product Obsolescence 14

4.6.10 Qualification Process 14

4.6.11 Production line final test 14

4.6.12 Acceptance Testing 14

5. Interfaces 14

6. Performance 14

6.1 Electrical Performance. 14

6.2 Mechanical Interface 14

6.3 Environmental Interface Performance 14

6.4 System Effectiveness Performance 14

7. Application Guidance 15

7.1 System Element Usage 15

7.2 Architectures 16

7.3 Economic 16

7.4 System interaction – write as a general guideline 16

7.4.1 Stability - Includes Regulation parameters 16

7.4.2 Redundancy methods 16

7.4.3 Current Sharing Methods: Application Guideline 16

7.4.4 Thermal issues 17

7.4.4 Grounding issues 17

7.4.5 17

7.4.6 Sensing 17

7.4.7 Supervisory Monitoring and Control 17

7.4.8 EMC 18

7.4.9 Physical Environment (Mechanicals) – shock, vibration, structural 18

7.5 Accommodation 18

7.5.1 heat shielding 19

7.5.2 directing cooling air 19

7.5.3 designing shock absorbers into the mounting 19

7.5.4 transients 19

7.5.5 software/firmware 19

7.5.6 others 19

8. Switching Frequency Stability move to section 7.4.4 TBD 19

8.1 Introduction 19

8.2 Fixed Frequency 19

8.3 Variable Frequency 20

8.4 The impact of switching frequency stability on EMI 20

8.5 Output Noise 20

8.6 21

9. ANNEX Parameter Index 21

Figures

Figure 1. Power Subsystem Interfaces *

Figure 2. Power Element Interfaces Indicating Accomodation *

Figure 1 Power Subsystem Interfaces 2

Figure 1 Power Subsystem Interfaces 6

Figure 1 Power Element Interfaces indicating Accomodation 17

Figure 1 Power Subsystem Interfaces Error! Bookmark not defined.

Tables

Table 1 General Electrical Interface Performance *

Table 2 Electrical Interface: Output/Load Performance *

Table 3 Electrical Interface Source Performance *

Table 4 Mechanical Interface Performance *

Table 5 Environmental Interface Performance *

Table 6 System Effectiveness Interface Performance *

Table 7 General Electrical Interface Parameters *

Table 8 Electrical Output/Load System Interface *

Table 9 Electrical Source System Interface Parameters *

Table 10 Environment System Interface Parameters *

Table 11 System Effectiveness Interface Parameters *

Table 1 General Electrical Interface Performance 23

Table 2 Electrical Interface: Output/Load Performance 25

Table 3 Electrical Interface Source Performance 28

Table 4 Mechanical Interface Performance 30

Table 5 Environmental Interface Performance 34

Table 6 System Effectiveness Interface Performance 38

Table 7 General Electrical Interface Parameters 40

Table 8 Electrical Output/Load System Interface 40

Table 9 Electrical Source System Interface Parameters 41

Table 10 Environment System Interface Parameters 43

Table 11 System Effectiveness Interface Parameters 43

Table 1 GENERAL ELECTRICAL INTERFACE Performance 2

Table 2 Electrical Interface: Output/Load Performance 2

Table 3 Electrical Interface Source Performance 2

Table 4 Mechanical Interface Performance 2

Table 5 Environment Interface Performance 2

Table 6 System Effectiveness Interface Performance 2

Table 7 General System Interface Parameters 2

Table 8 Electrical Output/Load System Interface 2

Table 9 Electrical Source System Interface Parameters 2

Table 10 Environment System Interface Parameters 2

Table 11 System Effectiveness Interface Parameters 2

Table 1 General Interface Performance 24

Table 2 Electrical Interface: Output/Load Performance 26

Table 3 Electrical Interface Source Performance 29

Table 4 Mechanical Interface Performance 31

Table 5 Environment Interface Performance 35

Table 6 System Effectiveness Interface Performance 39

Table 7 General System Interface Parameters 41

Table 8 Electrical Output/Load System Interface 41

Table 9 Electrical Source System Interface Parameters 42

Table 10 Environment System Interface Parameters 44

Table 11 System Effectiveness Interface Parameters 44

Table 1 Acronyms and Abbreviations Error! Bookmark not defined.

Table 2 General Interface Performance 14

Table 3 Electrical Interface: Output/Load Performance 14

Table 4 Electrical Interface Source Performance 14

Table 5 Mechanical Interface Performance 14

Table 6 Environment Interface Performance 14

Table 7 System Effectiveness Interface Performance 14

 

 

 

 

Draft Recommended Practice for Electronic Power Subsystems: Parameters, Interfaces, Elements, and Performance

 

 

  1. Overview
    1. Scope.

      2. The Recommended Practice for Electronic Power Subsystems: Parameters, Interfaces, Elements, and Performances is intended for designers, integrators and manufacturers of power electronics. This document provides interface definitions and application guidance, including parametric values characterization for power electronics subsystems consisting of single or multiple elements. Only supervisory monitoring and control software is mentioned.

      The Recommended Practice applies to ac-dc and dc-dc electronic power subsystems. The range of power subsystems includes dc, single phase, and three-phase inputs, with elements having power levels from a fraction of a watt to 20 kW. The voltage range is 600 V and below, at a frequency or frequencies of dc -1 kHz. The recommended practice may be used outside the range where applicable.

    3. Purpose.

      4. From PAR: There are no defined interfaces for power electronic subsystems. The Recommended Practice is intended for designers, integrators and manufacturers of power electronics. This document provides interface definitions and application guidance, including parametric values for power electronic subsystems consisting of single or multiple elements.

      The purpose of this Recommended Practice is to creates avenues to expand the use of Commercial Item Power Electronics (CIPE) and the elements that form them.

      There are no defined interfaces for power electronic subsystems. The Recommended Practice is intended for designers, integrators and manufacturers of power electronics subsystems to exchange unambiguous data.

    4. This document provides interface definitions and application guidance, including parametric values for power electronic subsystems consisting of single or multiple elements.
    5. Note: Consider the following for deletion
    6. This purpose of this Recommended Practice is identification of parameters and interfaces for elements assembled into an electronic power subsystem. Performance ranges for the parameters and subsystems are provided.
    8. The Recommended Practice provides guidance in performance of the following functions:
    10. System Designer/Developer (define overall system architecture including power subsystem requirements)
    11. Provides parameter guidelines
    12. Provides overall system boundaries consistent with available products, as defined herein
    14. Power Subsystem Developers (choose power subsystem elements and architecture)
    15. Provides achievable power subsystem parameters
    16. Lists available elements
    17. Application guidance facilitating the use of available items
    18. May provide test methodologies for subsystems
    20. Manufacturers (design and manufacture subsystem elements)
    21. Provides a standard format for reporting product performance
    22. Guideline to understand system developer requirements
    24. Organization of the recommended pPractice

    (need to fix clause numbers, and then refer to them in numerical order)

    Interfaces are defined in Clause 3.6.6. Annex B indicates the location of the description of all parameters addressed by this document, IEEE Std. 1515 - 2000 or within this document. NOTE: Insert as clause after purpose. Parts of the following need to be placed in a "Document Overview" or "How to Use this Document" clause. Parameters relating to each of the interfaces are listed in Tables 1 through 6. Each parameter is defined in Clause 6. Annex A Clause 7 provides columns indicating performance levels "Commonly Available" (from manufacturer’s catalog items) and. Clause 7 also includes a an "Extraordinary Requirements" column listing the performance levels needed in current militarysome highly demanding applications. This allows the designers to use the Recommended Practice to determine (perform trade-off analyses) the extent that CIPE products may be used toin configureing a particular electronic power electronic subsystem. Clause 5 provides Application Guidance for some aspects of power electronic subsystems.

     

    Software used to implement internal functions within a power element is not considered in this document, since it is part of the black-box performance. However, software which directly affects the performance of an interface between elements (for example, a control or monitoring interface) must be considered as part of the interface. This is discussed more fully in section 5.3.1.

  2. References

    3. [1] IEEE Std. P1515 - 2000, Recommended Practice for Electronic Power Subsystems: Parameter Definitions, Test Conditions, and Test Methods

    [2]

    Federal Acquisition Regulations (FAR), Part 2 Definitions of Words and Terms, (FAC 97-17), 25 April 2000

    [3] United States Air Force Scientific Advisory Board, Report on Ensuring Successful Implementation of Commercial Items in Air Force Systems, SAB-TR-99-03, April 2000

  3. Definition of tTerms and Terms, aAcronyms

    4. Editors note: Consider combining terms and acronyms number each individually. See 1515 and Abbreviations

    1. Acronyms and Abbreviations

      2. A Ampere

      aAc Alternating Current

      ATP Acceptance Test Plan

      BABT British Approvals Board for Telecommunications (Certification Company)

      BIT Built In Test

      BW Bandwidth

      ° C Degrees Centigrade

      CE European Union Conformity Mark (European Commission)

      CG Center of Gravity

      CI Commercial Item

      CM Common Mode

      COTS Commercial-Off-The-Shelf (equivalent to CI)

      CSA Canadian Standards Association

      dc Direct Current

      di/dt Rate of Current Change

      DIN Deutsches Institut fur Normung (German Standards Institute)

      DIP Dual In-Line Pins

      DM Differential Mode

      EMC Electromagnetic Compatibility

      EMI Electrom Magnetic Interference

      EPSS Electronic Power Specification Standardization

      ESD Electros Static Discharge

      ESS Environmental Stress Screening

      ET Elapsed Time

      FAR Federal Acquisition Regulations

      FCC Federal Communications Commission

      FIT Failure in Time

      GIDEP Government-Industry Data Exchange Program

      HALT Highly Accelerated Life Test

      HIRF Highly Intensified Radio Frequency

      Hz Hertz

      I Current

      IAW either delete or identify

      I/F Interface

      I/V Current/Voltage

      ID Identify

      IEC International Electrotechnical Commission

      IEEE Institute of Electrical and Electronics Engineers

      Iin Input Current

      ISA Industry Standard Architecture Bus

      ISO International Organization for Standardization

      JEDEC Joint Electron Device Engineering Council

      kHz Kilohertz

      LFM Linear Feet/Minute

      MHz Megahertz

      ms Milliseconds

      MSDS Material Safety Data Sheet

      MTBF Mean Time Between Failures

      NA Not Applicable

      nom Nominal

      OSJTF Open Systems/Joint Task Force

      PCMCIA Personal Computer Memory Card International Association

      p-p Peak to Peak

      ppm parts per million

      PSI Pounds per square inch/In2

      PWA Printed Wiring Assembly

      PWM Pulse Width Modulation

      QPL Qualified Parts List

      RF Radio Frequency

      SAM Standard Aerospace Module

      SEM Standard Electronic Module

      SIP Single In-Line Pins

      SPC Statistical Process Control

      STP Standard Temperature and Pressure

      TBD To Be Determined delete?

      TCE Temperature Coefficient

      TUV TÜV Rheinland (Certification Company)

      U Eurostandard height unit approximately 1.75"

      UL Underwriters Laboratory

      usec Microsecond

      V Volt

      Vac ac Volts

      Vdc dc Volts

      VDE Verband Der Elektrotechnik (The Association for Electrical, Electronic & Information Technologies)

      Vin Input Voltage

      VME Versa Module Europa

      Vout Output Voltage

      WVout WattsOutput Voltage

      Zin Input Impedance

      Zload Load Impedance

      ZouW Output ImpedanceWatts

      ZCS Zero Current Switching

      ZVS Zero Voltage Switching

    2. TermsPower Sub-System Interface Parameters
      1. General Power Sub-System Interface Parameters
      2. Contact Resistance NOTE: Consider Hot Swap ie. max interrupt current vs. max current
        1. Definition

          2. The resistance found between two mating surfaces is generally determined by the surface contact area, pressure between the two mating surfaces, and the materials used for the contacts.

        2. Test Method

          3. Apply a current equal to the mated rating of the connecting feature (pin, screw terminal, bus bar) and measure the voltage drop across the junction of the connection. The value obtained by dividing the measured voltage drop by the current applied represents the contact resistance.

          NOTE: Add detail about connector types. Thermal considerations such as ambient temperature, heating. Number of mating cycles

           

        3. ESD
      3. Electrostatic Discharge (ESD)
        1. Definition.

          2. Electrostatic Discharge is the sudden occurrence of current flow where a difference in dc voltage is equalized by a flow of charge between two electrically isolated bodies. This equalization is characterized by a rapid current flow that may also involve an arc discharge between what is primarily the capacitively stored charge on one or all involved bodies so that the voltage on the mutual bodies is essentially equal after the current flow.

          ESD control is the process of minimizing possibility of the adverse occurrence of a rapid charge transfer. NOTE save for application guideline. Harry

        2. Definition

          3. Electrostatic Discharge. A phenomenon created in low humidity environments where an object collects an excess amount of charge. When this object comes within close proximity to an object of oppositely charged particles, the charge will transfer to the oppositely charged object, sometimes creating a spark. With or without a spark, this transfer of electrons has been shown to degrade, damage, or destroy electronic circuitry.

        3. Define level of sensitivity to ESD, level 1, 2, or 3.

        Test Method: Varying voltage levels are general stored in a fixed capacitance and then applied through a fixed impedance. All externally accessible electrical interfaces to the unit should be tested IAW the intended environment. Look into definitions provided through MIL STD’s.

      5. Status Monitoring

        6. Definition

        The capability to detect that key parameters of the power system are within pre-determined limits, and provide an indication if one or more of the monitored parameters is outside the pre-determined limits. This capability may also provide an indication if a failure is detected in a sub-system or module within the power system even if the performance parameters remain within the predetermined limits.

      6. Supervisory Control

        7. Definition

        The capability to allow alteration of the power system state through local or remote control interface to meet overall performance objectives. Examples include remote resetting of protection circuits, remote on-off capability of system components, alteration of output voltage and/or current settings, etc.

        4.1.4.2 BIT per P1515 (TBD not defined in P1515, add definition herefind the correct location)

        Electrical Output/Load System Interface

      7. Regulation, Combined

        8. Definition

        The sum of the effects of line, load and temperature regulation as defined in (P1515, sections ra. TBD4.4.1, 4.4.2, and 4.4.3 respectively).

      8. Regulation effects due to aging

        9. Definition

        Degradation in combined regulation due to life or long term effects.

      9. Set point voltage accuracy
        1. Definition

        The maximum deviation from a specified voltage under defined operating conditions. The accuracy is commonly expressed as a percentage deviation from the specified voltage.

      10. Power Density save here, add to sys application

        11. Definition

        The ratio of total rated output power to power subsystem volume, including all interface requirements imposed by the identified power subsystem. This normally includes EMI filters and heat exchanger volume. A given electronic power sub-system can have different power density ratings in different applications.

      11. Switching Frequency Variability
        1. Definition

          2. The range of switching frequencies over which normal operation can occur.

          NOTE: (discussion) Users must be aware that switching converter switching frequency must be understood. The system designer must address frequencies that are of concern to the application.

        2. Test Method

        Measure the switching frequency by way of the input and output ripples’ fundamental frequency(see P1515 para. TBD).

      12. Synchronization of elements save here

        13. Definition

        Operation of power electronic elements at a common frequency or multiple of a common frequency; achieved via a synchronization signal between modules and / or an external interface.

      13. Noise spectrum – EMCI
      14. Low Voltage Protection

        15. Low voltage protection can be the function of a component or circuit in a power subsystem designed to sense and provide protection against either an input or output voltage that is below the level of normal or safe operation by reducing the subsystem operating stress or shutdown. This abnornal condition is usually reported by the subsystem as a failure to a monitoring system.

      15. Overcurrent characteristics

      16. Overcurrent characteristics are the features of multiple overload conditions in a power subsystem that can be caused or influenced by events such as worst case load changes, unstable output voltage regulation, or external/internal short circuits which force the subsystem to draw an excessive deviation of the defined operating current limits.

      17. Overtemperature shutdown

        18. Definition

        A function which causes the power system to automatically shut itself down if the temperature at a pre-determined monitoring point exceeds a pre-set threshold.

        Electrical Source System Interface Parameters

      18. Reverse Polarity Protection

        19. Definition

        The capability of a power element to withstand, without damage, the continuous application of a DC voltage when the positive and negative connections are interchanged.

        TBD move to application : Reverse Polarity Protection: Ability of a Power Electronic Subsystem to withstand without damage the application of input and/or output power connections in reverse order. Usually implemented via either shunt or series protection devices. Shunt protection will typically present low impedance to the source, which may draw current sufficient to trip external protection devices, and series protection will typically present high impedance to the source approximating an open circuit.

        Mechanical System Interface Parameters

      19. Thermal Interface Type – simple definition of type

        20. Definition.

      20. Cooling Provision

        21. Per P1515, 5.4.7 (Cooling Requirements).

        1. Conduction Cooling

          2. Definition.

        2. Convection Cooling

          3. Definition.

        3. Airflow

          4. Definition.

        4. Pressure drop/back pressure
        5. Temperature Rise

          6. Definition

          The increase in temperature at the point of interest when the power system is in operation as compared to the temperature at the same point when the power system is not operating (and has been shut down for a long enough time to fully cool down). Normally the temperature rise is measured after the power system has been in operation long enough to reach thermal equilibrium.

        6. Maximum Inlet Temperature

          7. Definition

          The maximum allowable temperature of the cooling medium, at the point where it enters the power system, required to maintain the power system elements within their safe operating temperature range.

        7. Liquid Cooling (closed system)
        8. (Heat Pipe) – phase change TBD review table
        9. Flow rate
        10. Pressure drop

         

      21. Cooling Medium save here

        22.  

        Definition.

        A liquid or gas used as a heat transfer material in a heat flow path.

      22. Maximum Power Dissipation
      23. Definition

        24. TBD The amount of power that will be dissipated by the power subsystem under the combined specified conditions.

      24. Packaging
      25. Definition

        26. Physical characteristics of the subsystem. ( NOTE: add to table if not already included: physical dimensions, materials, potting, sealing, etc described by dimensional drawings, identification of connectors, thermal performance data, and generic package identification.)

         

        NOTE: The distinction between Component, Card/PWA, and Box is made in this document to facilitate definitions of electrical and mechanical interface parameters for various levels of power electronic subsystems.

        1. Component

          2. Definition

          A single low level replaceable circuit element. Card or Printed Wiring Assembly

        2. Card or Printed Wiring Assembly

          3. Definition

          A power electronic element consisting of a single card or printed wiring assembly (PWA) which may include "daughter" cards. Cards may consist of individual passive and active electronic components and / or power electronic subsystem components such as DC-DC converters.

        3. Box

        Definition

        A power electronic element consisting of multiple Cards or PWAs and/or other assemblies within an enclosed housing. Such elements may be a replaceable part of a larger assembly or a standalone unit.

      26. Electrical Terminations (for components / PWAs / BoxAssemblies) save here

        27. Definition

        Physical attachments to achieve electrical interface connections.

      27. TBD move to application guideline or editorial note.
      28. For component level elements these are typically either pins suitable for directly soldering in PWAs or insertion in connector sockets or terminals suitable for soldering wires to.
      29. For card / PWA level elements there is a wider variety of possible terminations, most common being some type of board mounted connector, usually for mating to a motherboard connector in a next higher assembly.
      30. For Box / LRU level assemblies these are usually some type of pins, lugs, bus bars, or enclosure mounted connector for mating to a cable assembly in the using system.
      31. Physical Characteristics fix tableTBD
      32. Definition
      33. Characteristics that determine the applicability of a particular material and packaging type to system requirements for parameters such as safety and materials compatibility.
        {Note: I’m not too clear on this one. The parameter title seems too broad for the definition. To generate the definition I referred to the parameter examples listed in Section 6.2, Parameter 5.}
      34. Center of Gravity(CG)
      35. Definition
      36. The physical location within a component for which the remainder of the mass in all three planes(X,Y,Z) is centered.
      37. Test Method:
      38. Using a clamping device of suitable size for the unit being measured, and a mechanism for allowing the unit to rotate freely. Position the clamp near the apparent center of the unit and tighten. Rotate the unit about the clamping device and allow the unit to come to rest naturally. Once at rest, loosen the clamping device and reposition the clamp on the unit at a point lower than the initial position. Repeat this process until the unit is positioned in the clamp such that when rotated and allowed to come to rest naturally, the resulting at rest position is random.
      40. Repeat the procedure for the remaining planes to be measured.
      41. Environment System Interface Parameters
      42. Definition.
      45. Definition.
      52. Definition.
      54. Combined Effects save here

        55.  

         

        Definition.

        Generally used in a specification sense where two or more critical parameters are considered to be acting on a power electronic element so as to influence performance.

      59. Definition.
      62. Definition.
      65. Definition.
      69. Resistance to materials (jet fuel, hydraulic fluid, de-icer, gases, corrosive agents)
      70. Sand and dust
      71. Explosive atmosphere
      72. Combined effects (Many Environments @ once)
      73. Acoustic Susceptibility
      74. Acoustic Emissions/ audible noise.
      75. Radiation
      76. System Effectiveness Interface Parameters
      77. Compliance Information, e.g., Agency Approvals
      78. Definition
      79. List of agency accreditations including any limitations to the accreditation. For example, CE, FCC, UL and the section or paragraph for which accreditation was granted.
      80. Product Life
      81. Definition
      82. Product Life – The useful life of a subsystem statistically calculated for specified maintenance and operating conditions. Maintenance includes replacement of short life components as required.
      83. Component Quality
      84. Definition
      85. Level of conformance to requirements as indicated by defect rate, eg. defective parts per million (ppm). add acronym TBD).
      86. Derating
      87. Definition
      88. Operating components below their rated operating limits to extend their useful life or reliability. Derating is usually stated as a percentage of rated operating limits.
      89. Quality Control
      90. Definition
      91. A documented, systematic approach to ensure material, process, and test used in design and manufacture of a product so that performance is predictable and sufficient to meet requirements, eg ISO 9000.
      92. Configuration Management
      93. Definition
      94. A process of identification systems that tracks versions of configured subsystems. Subsystems may include software, firmware, and hardware assemblies. The configuration management system may include record keeping by part, production run, or other relevant grouping.
      95. Warranty TBD what is diff between waranty and guarantee
      96. Definition
      97. A legal obligation that a product will perform within its specifications for a specified period of performance. Remedies for failure to perform as warranted are stated.
      98. Test Equipment Calibration and Standards
      99. Definition
      100. Procedures to ensure that test equipment used to verify product compliance to design or performance specifications is accurate. Typically a calibration requirement includes a schedule for calibration, the standard to which the equipment is to be calibrated, instructions about handling product that was found to have been certified with out of calibration test equipment, and record keeping requirements such as calibration logs and equipment stickers.
      101. Product Obsolescence
      102. Definition
      103. The condition that occurs at a point in time when a product is no longer readily available or supported.
      104. TBD editorial note One must consider the effect on system availability if parts in the system are obsolete. Life time buy,
      105. Qualification Process
      106. Definition
      107. The method used to determine that a product meets its specification requirements. Qualification may be performed by any one or a combination of similarity, analysis, or test at various stages of product integration to verify that specified requirements are being met. NOTE: define similarity, analysis, test
      108. Production line final test
      109. Definition
      110. Acceptance Testing
      111. Definition
      112. Functional testing of the product to requirements.
      113. Definition of terms
      114. Commercial Off-The-Shelf (COTS) (from Ensuring Successful …)
      115. Items which can be purchased through commercial retail or wholesale distributors, as is, and are generally available as a catalog item.
      116. Commercial Component (from FAR)
      117. Any component that is a commercial item.
      118. Commercial Item (Reference [excerpted from FAR2])

        119. Commercial item means --

        (a) Any item, other than real property, that is of a type customarily used for non-governmental purposes and that --

        (1) Has been sold, leased, or licensed to the general public; or,

        (2) Has been offered for sale, lease, or license to the general public;

        (b) Any item that evolved from an item described in paragraph (a) of this definition through advances in technology or performance and that is not yet available in the commercial marketplace, but will be available in the commercial marketplace in time to satisfy the delivery requirements under a Government solicitation;

        (c) Any item that would satisfy a criterion expressed in paragraphs (a) or (b) of this definition, but for --

        (1) Modifications of a type customarily available in the commercial marketplace; or

        (2) Minor modifications of a type not customarily available in the commercial marketplace made to meet Federal Government requirements….

      119. Commercial Component (from FARReference [2])

        120. Any component that is a commercial item.

      120. Commercial Off-The-Shelf (COTS) (from Ensuring Successful …) Reference [3])

        121. Items which can be purchased through commercial retail or wholesale distributors, as is, and are generally available as a catalog item.Interfaces

        The electronic power elements can be modeled as "black boxes" whose contents are unknown. Four element power subsystem interfaces are identified: Electrical, Mechanical, Environmental, and System Effectiveness.. By specifying the interface parameter’s performance ranges, it can be determined whether a particular element is suitable for an application or a particluar application’s requirements can be determined. See Figure 1, Power Sub-System Interfaces. TBD expand this

         

        Figure 1. Power Subsystem InterfacesFigure 1

        Power Subsystem Interfaces

         

      121. Elements

    Elements are defined as physically realizable building blocks of an electronic power subsystem. Elements may be realized in a variety of packages such as components, cards, or boxassemblies.

    Editorial Note. Ideally, they are commercially available products, in current high volume manufacture for multiple applications, and conforming to defined, non-proprietary, industry standard interfaces.

  6. Intro paragraph: Power System Architecture - Joe Ortiz/Rich Buck

    7. Intro paragraph: How doc will assist the reader

    Definition/description of power subsystem

    Add diagram of power system architecture hierarchical diagram

    System architecture examples medical, telecom, automotive, avionics

    1. System Element and Architecture Definition move to Power System Architecture - Ernie Parker

      2. It is beyond the scope or the intent of this document to discuss or dictate the internal aspects of these elements or to specify the manner in which they are assembled to create a power electronics sub-system. There are, however, considerations in applying these elements that can facilitate the match of commercially available elements to application requirements and the successful implementation of a power electronic sub-system that consists of an interconnection of multiple elements. These considerations fall in the categories of requirement definition, architectural considerations, and system interaction.

      1. Requirements

        2. Requirement definition, at each level in the power sub-system’s development, is perhaps the most crucial and potentially limiting task in the evolution toward development of the end product. This document is intended to reduce that limitation by providing common terminology and definitions for sub-system parameters and by quantifying typically required, and more importantly, typically available values for these parameters. Caution, however, is urged in the use of these quantified parameters. At their extremes they represent current state-of-the-art product on the commercial market at a particular element level. Sub-system products defined by combinations of these values may neither be available with current element products or economically achievable. Values such as power density or reliability available with low level building block elements will generally have to be relaxed for sub-systems built with combinations of these and other elements. Guidelines for successful requirement definition include leaving interface parameter definitions as loosely defined as practical and involving manufacturers of building block elements under consideration in trade-off decisions during the requirement definition process.

         

        Figure 2. Power Element Interfaces Indicating Accomodation

      2. Architecture

    Architectural considerations are also key to successful electronic power sub-system definition. The primary sub-system and building block element interfaces, as defined in this document, are electrical, mechanical, environmental, and system effectiveness. One or more of these interfaces may not ideally map from an application’s required interface to the element’s available interface. Mapping between these interface requirements may be possible with specific architectural arrangements of available elements and or by providing additional circuitry or buffering between system and element interfaces. The interface architecture model Error! Reference source not found. depicts these architectural considerations. Examples of methods for mapping required interfaces to available elements are depicted for each of the defined interfaces.

     

    Architectures that facilitate the use of available products – insert architecture diagram, target high volume industry to map to a general architecture (automotive, telecom)

     

     

  7. Interface Definition - Yan- Fei Liu/ Rick Eddins

    8.  

    Interfaces between elements and at higher subsystem levels.

     

    replace the following paragraph

    Power electronics elements can be modeled as "black boxes" whose contents are unknown. Four element interfaces are identified: Electrical, Mechanical, Environmental, and System Effectiveness. By specifying the interface parameter’s performance ranges, it can be determined whether a particular element is suitable for an application or a particluar application’s requirements can be determined. See

     

    Modify drawing , element in middle, remove buffering boxes

    Figure 3

     

    1. Electrical Interface.

      2. The electrical interface is bounded by the input voltage and the output voltage. There may be control signals or test points which need to be addressed. There can be various configurations within this boundary whose internal interfaces are unknown. Several "building blocks" can be connected together with one blocks’ output connected to the next blocks’ input. Blocks may be components or cards. Table 1, Table 2 and Table 3 describe electrical performance.

       

    2. Mechanical Interface

      3. The mechanical interface includes size, mounting methods, thermal requirements, external connections, etc.

    3. Environmental Interface

      4. There are several conditions to consider for environmental Performance. The operating and non-operating environments have to be defined. There may be several different environments within one platform such as wing pylons vs. cockpits of fighter aircraft. Performance may also be life expectancy oriented or simply robustness indicators. Add other I/F table headers rewrite

    4. System Effectiveness

    System Effectiveness Performance is concerned with reliability and maintainability.

     

     

     

    Use this figure in section 10 adaptation section

    Figure 1. Power Subsystem Interfaces

  8. Electrical Interface Parameters
    1. EMC - Ernest Fierheller
      1. Lightning, Surge and transients - - Ernest Fierheller

        2. mention source and load impedance

      2. Noise spectrum – EMC E/D/MELECTRICAL/DEFINITION/TEST METHOD/ reference only- Ernest Fierheller
        1. Definition

          2.  

        2. Test Method – by reference only

         

      4. Electrostatic Discharge (ESD) - Ernest Fierheller
        1. Definition. Alternative 1

        Electrostatic Discharge is the sudden occurrence of current flow where a difference in dc voltage is equalized by a flow of charge between two electrically isolated bodies. This equalization is characterized by a rapid current flow that may also involve an arc discharge between what is primarily the capacitively stored charge on one or all involved bodies so that the voltage on the mutual bodies is essentially equal after the current flow.

        ESD control is the process of minimizing possibility of the adverse occurrence of a rapid charge transfer. NOTE save for application guideline. Harry

        Definition Alternative 2

        Electrostatic Discharge. A phenomenon created in low humidity environments where an object collects an excess amount of charge. When this object comes within close proximity to an object of oppositely charged particles, the charge will transfer to the oppositely charged object, sometimes creating a spark. With or without a spark, this transfer of electrons has been shown to degrade, damage, or destroy electronic circuitry.

      5. Define level of sensitivity to ESD, level 1, 2, or 3. - Ernest Fierheller
        1. Test Method

      Varying voltage levels are general stored in a fixed capacitance and then applied through a fixed impedance. All externally accessible electrical interfaces to the unit should be tested in accordance withIAW the intended environment. Look into definitions provided through MIL STD’s.

    2. Stability
      1. Regulation, Combined E/D/MELECTRICAL/DEFINITION/TEST METHOD/C/Test Condition/
        1. The sum of the effects of line, load and temperature regulation as defined in P1515, sections 4.4.1, 4.4.2, and 4.4.3 respectively.Definition

          2. The sum of the effects of line, load and temperature regulation as defined in P1515, sections 4.4.1, 4.4.2, and 4.4.3 respectively.

        2. Test Method

          3.  

        3. Test Condition

         

      3. Regulation effects due to aging E/DELECTRICAL/DEFINITION

        4. Degradation in combined regulation due to life or long term effects.

      4. Switching Frequency Variability
        1. Definition

          2. The range of switching frequencies over which normal operation can occur.

          NOTE: (discussion) Users must be aware that switching converter switching frequency must be understood. The system designer must address frequencies that are of concern to the application.

        2. Test Method

      Measure the switching frequency by way of the input and output ripples’ fundamental (TBD switching frequency is referenced in P1515) frequency (see P1515 Ripple and Spikes Section 4.5).

    3. Voltage and current
      1. Set point voltage accuracy E/D/MELECTRICAL/DEFINITION/TEST METHOD/C/Test Condition
        1. Definition

          2.  

        2. Test Method

          3.  

        3. Test Condition

         

      2. Maximum Power Dissipation E/DELECTRICAL/DEFINITION/review 1515 Methods and conditions

        3. TBD The amount of power that will be dissipated by the power subsystem under the combined specified conditions.

      3. Contact Resistance
        1. Definition

          2. The resistance found between two mating surfaces is generally determined by the surface contact area, pressure between the two mating surfaces, and the materials used for the contacts.

        2. Test Method

          3. Apply a current equal to the mated rating of the connecting feature (pin, screw terminal, bus bar) and measure the voltage drop across the junction of the connection. The value obtained by dividing the measured voltage drop by the current applied represents the contact resistance.

          NOTE: Add detail about connector types. Thermal considerations such as ambient temperature, heating. Number of mating cycles. Consider Hot Swap ie. max interrupt current vs. max current

        3. Test Condition
    4. Supervisory and control – David Cooper
      1. Status Monitoring E/DELECTRICAL/DEFINITION

        2. The capability to detect that key parameters of the power system are within pre-determined limits, and provide an indication if one or more of the monitored parameters is outside the pre-determined limits. This capability may also provide an indication if a failure is detected in a sub-system or module within the power system even if the performance parameters remain within the predetermined limits. BIT

      2. Supervisory Control E/DELECTRICAL/DEFINITION

        3. The capability to allow alteration of the power system state through local or remote control interface to meet overall performance objectives. Examples include remote resetting of protection circuits, remote on-off capability of system components, alteration of output voltage and/or current settings, etc.

      3. BIT E/DELECTRICAL/DEFINITION
    5. Protection - Carlos Gonzalez
      1. Voltage Protection (add under and over) E/DELECTRICAL/DEFINITION

        2. Low voltage protection can be the function of a component or circuit in a power subsystem designed to sense and provide protection against either an input or output voltage that is below the level of normal or safe operation by reducing the subsystem operating stress or shutdown. This abnornal condition is usually reported by the subsystem as a failure to a monitoring system.

      2. Overcurrent characteristics (implementation and recovery) E/DELECTRICAL/DEFINITION

        3. (Table items need to be defined.) Overcurrent characteristics are the features of multiple overload conditions in a power subsystem that can be caused or influenced by events such as worst case load changes, unstable output voltage regulation, or external/internal short circuits which force the subsystem to draw an excessive deviation of the defined operating current limits.

      3. Overtemperature shutdown E/D/MELECTRICAL/DEFINITION/TEST METHOD/C/Test Condition
        1. A function which causes the power system to automatically shut itself down if the temperature at a pre-determined monitoring point exceeds a pre-set threshold.Definition

          2. A function which causes the power system to automatically shut itself down if the temperature at a pre-determined monitoring point exceeds a pre-set threshold.

        2. Test Method

          3.  

        3. Test Condition

         

      5. Reverse Polarity Protection E/D/MELECTRICAL/DEFINITION/TEST METHOD/C/Test Condition
        1. The capability of a power element to withstand, without damage, the continuous application of a DC voltage when the positive and negative connections are interchanged.Definition

          2.  

        2. Test Method

          3.  

        3. Test Condition

     

  10. Mechanical Interface
    1. Thermal Interface M/DMECHANICAL/DEFINITION - Harry Lamberth

      2. Note: May need to revisit for reorg. In doc. Conduction vs. Radiation Convection?

      A thermal interface is normally a junction where there is a material type discontinuity in the heat flow path. This interface may have various physical spacing involving configurations ranging from the radiation into free space (or a vacuum) to a "hard" cemented or brazed junction.

      1. Conduction Cooling

        2. Conduction cooling normally involves a hard physical junction, but also includes transfer between any physical materials as opposed to radiation being the heat transfer mechanism, in the heat flow path. Harry

      2. Convection Cooling

        3. Convective cooling normally involves a free gaseous or liquid junction between other heat carrying materials in the heat flow path. The cooling medium in most such power electronics heat exchange interfaces is atmospheric air. Convection cooling normally is by "free" or unforced cooling medium flow as a consequence of the heat exchange process. "Forced" cooling uses a mechanically imposed pressure difference to cause the cooling medium to travel across the heat flow interface.

      3. Airflow

        4. Airflow normally refers to the flow of atmospheric air used as the cooling medium at a thermal interface. It may be referred to both as occurring in a supply duct or as the air passing over the actual heat exchange junction.

      4. Pressure drop/back pressure

        5.  

      5. Temperature Rise

        6. The increase in temperature at the point of interest when the power system is in operation as compared to the temperature at the same point when the power system is not operating (and has been shut down for a long enough time to fully cool down). Normally the temperature rise is measured after the power system has been in operation long enough to reach thermal equilibrium.

      6. Maximum Inlet Temperature

        7. The maximum allowable temperature of the cooling medium, at the point where it enters the power system, required to maintain the power system elements within their safe operating temperature range.

      7. Liquid Cooling (closed system)

        8.  

      8. (Heat Pipe) – phase change TBD review table

        9.  

      9. Flow rate

        10.  

      10. Pressure drop

       

    2. Packaging M/DMECHANICAL/DEFINITION - David Berry

      3. Physical characteristics of the subsystem. ( NOTE: add to table if not already included: physical dimensions, materials, potting, sealing, etc described by dimensional drawings, identification of connectors, thermal performance data, and generic package identification.)

      NOTE: The distinction between Component, Card/PWA, and BoxAssembly is made in this document to facilitate definitions of electrical and mechanical interface parameters for various levels of power electronic subsystems. Add graphic illustrating the following three levels:

      1. Component

        2. A single low level replaceable circuit element. Card or Printed Wiring Assembly

      2. Card or Printed Wiring Assembly

        3. A power electronic element consisting of a single card or printed wiring assembly (PWA) which may include "daughter" cards. Cards may consist of individual passive and active electronic components and / or power electronic subsystem components such as DC-DC converters.

      3. Assembly (change throughout document), Chassis, Enclosure, Box, Rack, etc

        4. A power electronic element consisting of multiple Cards or PWAs and/or other assemblies within an enclosed housing. Such elements may be a replaceable part of a larger assembly or a standalone unit.

      4. Center of Gravity(CG)
        1. Definition

          2. The physical location within a component for which the remainder of the mass in all three planes(X,Y,Z) is centered.

        2. Test Method:

    Using a clamping device of suitable size for the unit being measured, and a mechanism for allowing the unit to rotate freely. Position the clamp near the apparent center of the unit and tighten. Rotate the unit about the clamping device and allow the unit to come to rest naturally. Once at rest, loosen the clamping device and reposition the clamp on the unit at a point lower than the initial position. Repeat this process until the unit is positioned in the clamp such that when rotated and allowed to come to rest naturally, the resulting at rest position is random.

    Repeat the procedure for the remaining planes to be measured.

  11. Environmental -

    12. Note: consider adding hyperbaric, explosive decompression, etc.

    1. Resistance to materials ENVIRONMENTALnv/DEFINITION/TEST METHOD/C/TEST CONDITION - George Schoneman
      1. The capacity of a given substance, usually a solid physical structure or surface, to maintain its physical and electrical properties in the presence of the given material. These materials include corrosive agents, solvents, jet fuel, hydraulic fluid, de-icer, and etc. Definition

        2. The capacity of a given substance, usually a solid physical structure or surface, to maintain its physical and electrical properties in the presence of the given material. These materials include corrosive agents, solvents, jet fuel, hydraulic fluid, de-icer, and etc.

         

      2. Test Method

        3.  

      3. Test Condition

       

    3. Sand and Dust (corrosion, filters) ENVIRONMENTAL/DEFINITION/TEST METHOD/TEST CONDITIONEnv/D/M/C - George Schoneman
      1. Sometimes airborne, generally solid particulate matter, both organic and non organic, usually smaller than 0.005 inch in its major dimension of any given constituency. Sand and dust impacts filters, bearing surfaces, etc.Definition

        2. Sometimes airborne, generally solid particulate matter, both organic and non organic, usually smaller than 0.005 inch in its major dimension of any given constituency. Sand and dust impacts filters, bearing surfaces, etc.

      2. Test Method

        3.  

      3. Test Condition

       

    5. Explosive Atmosphere ENVIRONMENTAL/DEFINITION/TEST METHOD/TEST CONDITIONEnv/D/M/C- George Schoneman
      1. The property of an ambient free space containing any combustible, normally "airborne" material along with air or other oxidizer, that is susceptible to being ignited with an explosive consequence. The combustible material may be particulate, aerosol, or gas; this material will normally be the "fuel" in an oxygen/air mix. Electronic power elements may be required to operate in an explosive atmosphere without acting as a source of ignition.Definition

        2. The property of an ambient free space containing any combustible, normally "airborne" material along with air or other oxidizer, that is susceptible to being ignited with an explosive consequence. The combustible material may be particulate, aerosol, or gas; this material will normally be the "fuel" in an oxygen/air mix. Electronic power elements may be required to operate in an explosive atmosphere without acting as a source of ignition.

      2. Test Method

        3.  

      3. Test Condition

       

    7. Acoustic Susceptibility ENVIRONMENTAL/DEFINITION/TEST METHOD/TEST CONDITIONEnv/D/M/C - George Schoneman
      1. The tendency for an acoustic frequency to induce a physical, usually performance reducing, effect on a power electronic element due to exposure to a fluctuating gaseous pressure wave.
      2. Note: May also be used for ultrasonic frequencies.Definition

        3. The tendency for an acoustic frequency to induce a physical, usually performance reducing, effect on a power electronic element due to exposure to a fluctuating gaseous pressure wave.

        Note: May also be used for ultrasonic frequencies.

      3. Test Method

        4.  

      4. Test Condition

       

    8. Acoustic Emissions/Audible Noise (need to include human factors issues) ENVIRONMENTAL/DEFINITION/TEST METHOD/TEST CONDITIONEnv/D/M/C - George Schoneman
      1. The generation and presence of fluctuating gas pressures in the audible frequency range due to a physical movement of one or more components of some equipment or apparatus. Turbulent gas movement may also generate audible noise.
      2. Note: May also be used for ultrasonic frequencies.Definition

        3. The generation and presence of fluctuating gas pressures in the audible frequency range due to a physical movement of one or more components of some equipment or apparatus. Turbulent gas movement may also generate audible noise.

        Note: May also be used for ultrasonic frequencies.

      3. Test Method

        4.  

      4. Test Condition

       

    9. Radiation ENVIRONMENTAL/DEFINITIONEnv/D/ reference other sources for testing- Christian Lazarovici

    Radiation is the transmission of electromagnetic energy in a wave motion mechanism by means of a dynamic electromagnetic field not requiring a transmission medium. Radiation may include thermal, subatomic, or RF whether radiated or irradiated,. or subatomic particulate matter.

  12. System Effectiveness
    1. Product Life SE/D/MSYSTEM EFFECTIVENESS/DEFINITION/TEST METHOD/C/Test Condition – David Cooper/ Ernie Parker
      1. The useful life of a subsystem statistically calculated for specified maintenance and operating conditions. Maintenance includes replacement of short life components as required.Definition

        2. The useful life of a subsystem statistically calculated for specified maintenance and operating conditions. Maintenance includes replacement of short life components as required.

      2. Test Method

        3.  

      3. Test Condition

       

    2. Compliance Information, e.g., Agency Approvals save here

      3. List of agency accreditations including any limitations to the accreditation. For example, CE, FCC, UL and the section or paragraph for which accreditation was granted.

    3. Component Quality save here

      4. Level of conformance to requirements as indicated by defect rate, eg. defective parts per million (ppm).

    4. Derating save here app guideline

      5. Operating components below their rated operating limits to extend their useful life or reliability. Derating is usually stated as a percentage of rated operating limits.

    5. Quality Assurance (was Control) change table 6 item 8 save here

      6. A documented, systematic approach to ensure material, process, and test used in design and manufacture of a product so that performance is predictable and sufficient to meet requirements, eg ISO 9000.

    6. Configuration Management save here

      7. A process of identification systems that tracks versions of subsystems. Subsystems may include software, firmware, and hardware assemblies. Configuration management may include record keeping by part, production run, or other relevant grouping.

    7. Warranty save here

      8. A legal obligation that a product will perform within its specifications for a specified period of performance. Remedies for failure to perform as warranted are stated.

    8. Test Equipment Calibration and Standards save here application guide

      9. Procedures to ensure the accuracy of test equipment used to verify product compliance to design or performance specifications. Typically a calibration requirement includes a schedule for calibration, the standard to which the equipment is to be calibrated, instructions about handling product that was found to have been certified with out of calibration test equipment, and record keeping requirements such as calibration logs and equipment stickers. Bureau of standards link.

    9. Product Obsolescence vs discontinuance save here

      10. The condition that occurs at a point in time when a product is no longer readily available or supported.

      TBD editorial note One must consider the effect on system availability if parts in the system are obsolete. Life time buy,

    10. Qualification Requirements save here

      11. The method used to determine that a product meets its specification requirements. Qualification may be performed by any one or a combination of methods those being similarity, analysis, or test at various stages of product integration to verify that specified requirements are being met. NOTE: define similarity, analysis, test

    11. Production line final test

      12. save here

    12. Acceptance Testing save here

      13. Functional testing of the product to requirements.

    13. Screening save here

    Test every item or a sample item.

     

  14. Contact Resistance
      1. Definition

        2. The resistance found between two mating surfaces is generally determined by the surface contact area, pressure between the two mating surfaces, and the materials used for the contacts.

      2. Test Method

      Apply a current equal to the mated rating of the connecting feature (pin, screw terminal, bus bar) and measure the voltage drop across the junction of the connection. The value obtained by dividing the measured voltage drop by the current applied represents the contact resistance.

      NOTE: Add detail about connector types. Thermal considerations such as ambient temperature, heating. Number of mating cycles. Consider Hot Swap ie. max interrupt current vs. max current

    1. Electrostatic Discharge (ESD)
      1. Definition.

        2. Electrostatic Discharge is the sudden occurrence of current flow where a difference in dc voltage is equalized by a flow of charge between two electrically isolated bodies. This equalization is characterized by a rapid current flow that may also involve an arc discharge between what is primarily the capacitively stored charge on one or all involved bodies so that the voltage on the mutual bodies is essentially equal after the current flow.

        ESD control is the process of minimizing possibility of the adverse occurrence of a rapid charge transfer. NOTE save for application guideline. Harry

      2. Definition

        3. Electrostatic Discharge. A phenomenon created in low humidity environments where an object collects an excess amount of charge. When this object comes within close proximity to an object of oppositely charged particles, the charge will transfer to the oppositely charged object, sometimes creating a spark. With or without a spark, this transfer of electrons has been shown to degrade, damage, or destroy electronic circuitry.

      3. Define level of sensitivity to ESD, level 1, 2, or 3.
      4. Test Method

      Varying voltage levels are general stored in a fixed capacitance and then applied through a fixed impedance. All externally accessible electrical interfaces to the unit should be tested IAW the intended environment. Look into definitions provided through MIL STD’s.

    2. Center of Gravity(CG)
      1. Definition

        2. The physical location within a component for which the remainder of the mass in all three planes(X,Y,Z) is centered.

      2. Test Method:

      Using a clamping device of suitable size for the unit being measured, and a mechanism for allowing the unit to rotate freely. Position the clamp near the apparent center of the unit and tighten. Rotate the unit about the clamping device and allow the unit to come to rest naturally. Once at rest, loosen the clamping device and reposition the clamp on the unit at a point lower than the initial position. Repeat this process until the unit is positioned in the clamp such that when rotated and allowed to come to rest naturally, the resulting at rest position is random.

      Repeat the procedure for the remaining planes to be measured.

    3. Switching Frequency Variability
      1. Definition

        2. The range of switching frequencies over which normal operation can occur.

        NOTE: (discussion) Users must be aware that switching converter switching frequency must be understood. The system designer must address frequencies that are of concern to the application.

      2. Test Method

    Measure the switching frequency by way of the input and output ripples’ fundamental (TBD switching frequency is referenced in P1515) frequency (see P1515 Ripple and Spikes Section 4.5).

    Performance

  15. Parameters have been identified for each of the interfaces described in 3.1.4. For each parameter, performance ranges that are commercially available are indicated. Extraordinary requirements have been defined for many parameters. These are usually requirments for high reliability or harsh environment applications. This data has been compiled into tables TBD in Annex 7.1.add paragraph to reference tables
  16. NOTE: Commonly Available = Capability: Extraordinary Requirements = Requirements discussion about changing headers
  18. Application Guidance
  19. TBD add explanation of purpose for this section
  20. ASystem Integration & Adaptationpplication Guidance

    21. Application GuideanceThis section intends to addresses some of the issues of power electronics systemssupply switching design or specification. It is intended to cover the major items of concern and provide guidance to the designer as to the applicability of CI elements. This guideline is intended to be one source of information. The designer is encouraged to consult all available information about this subject matter and choose an appropriate module(s) that will provide the best overall system performance, considering pertinent parameters and system requirements.

    1. System Element and Architecture Definition move to Power System Architecture - Ernie ParkerUsage

      2. Identification of Power

      loads, sources, converters, filters, cards,

      Physical Elements are items such as cards, LRU/LRM/SRUs, and items used to construct an electronic subsystem

      (TBD) Logical Elements such as loads, filters, sources, converters, and other functional entities, used in the design of power subsystem architecture

      This document focuses on defining and quantifying the interfaces between power electronic subsystem elements(Move to abstract first sent.).

      It is beyond the scope or the intent of this document to discuss or dictate the internal aspects of these elements or to specify the manner in which they are assembled to create a power electronics sub-system. There are, however, considerations in applying these elements that can facilitate the match of commercially available elements to application requirements and the successful implementation of a power electronic sub-system that consists of an interconnection of multiple elements. These considerations fall in the categories of requirement definition, architectural considerations, and system interaction.

        2. Requirement definition, at each level in the power sub-system’s development, is perhaps the most crucial and potentially limiting task in the evolution toward development of the end product. This document is intended to reduce that limitation by providing common terminology and definitions for sub-system parameters and by quantifying typically required, and more importantly, typically available values for these parameters. Caution, however, is urged in the use of these quantified parameters. At their extremes they represent current state-of-the-art product on the commercial market at a particular element level. Sub-system products defined by combinations of these values may neither be available with current element products or economically achievable. Values such as power density or reliability available with low level building block elements will generally have to be relaxed for sub-systems built with combinations of these and other elements. Guidelines for successful requirement definition include leaving interface parameter definitions as loosely defined as practical and involving manufacturers of building block elements under consideration in trade-off decisions during the requirement definition process.

        3. Architectural considerations are also key to successful electronic power sub-system definition. The primary sub-system and building block element interfaces, as defined in this document, are electrical, mechanical, environmental, and system effectiveness. One or more of these interfaces may not ideally map from an application’s required interface to the element’s available interface. Mapping between these interface requirements may be possible with specific architectural arrangements of available elements and or by providing additional circuitry or buffering between system and element interfaces. Figure 1 depicts these architectural considerations. Examples of methods for mapping required interfaces to available elements are depicted for each of the defined interfaces.

         

        Architectures that facilitate the use of available products – insert architecture diagram, target high volume industry to map to a general architecture (automotive, telecom)

        System Interaction More needed TBD

      3. System interaction considerations are also key to successful sub-system implementation. Power electronic sub-systems are often as a distributed power architecture with one or more stages of series power conversion with the potential of parallel elements at each stage. Thermal, structural, and reliability interactions must also be considered which are discussed in section 7.4.
      4. Architectures
      5. Architectures that facilitate the use of available products – insert architecture diagram, target high volume industry to map to a general architecture (automotive, telecom)
      7. Economic

      – Specify only to the actual requirements, the limits of the requirements may not be available in combination. System developer should consider alternatives to accommodate available products. Work with manufacturer to achieve accommodation. Select the minimum parameter set that satisfies the requirements. For the selected parameter set, specify only to the actual requirements. If the limits of the requirements are not available in combination, the system developer should consider alternatives to accommodate available products. Work with manufacturer to achieve accommodation.

       

    2. System interaction – write as a general guideline - Ernie Parker/David Cooper

      3. System interaction considerations are also key to successful sub-system implementation. Power electronic sub-systems are often as a distributed power architecture with one or more stages of series power conversion with the potential of parallel elements at each stage. Thermal, structural, and reliability interactions must also be considered which are discussed in section 7.4.

      1. FMECA – Failure Modes Effects and Criticality Analysis as analysis tool

        2.  

      2. Stability - Includes Regulation parameters – Harry Lamberth/Ernest Fierheller
        1. Redundancy methods
          1. Current Sharing Methods: Application Guideline

            2. When constructing power electronic subsystems from available subsystem elements it is often desirable to parallel multiple elements for increased current / power rating. The potential for using such solutions is partially determined by the degree and method by which the elements will share supplying the system load. This guideline is intended to highlight items to bear in mind when considering use of paralleled elements, not to provide detail design implementation guidance. Some of the more common schemes are discussed:

          2. Direct parallel connection with no current share signal

            3. Elements connected in parallel without specific current share provisions will typically operate as follows. One element will typically have a regulation set point slightly higher than the remaining elements. This unit will take current until its output sags to below the no load regulation point of another element. With good load regulation this may not occur until the first element reaches current limit. Therefore this scheme will not work with shutdown or cyclic current limit schemes. Even with elements employing linear (square or foldback) current limit there may be performance problems since one or more elements operate in current limit as the system load is increased. As a minimum the elements must be safe for continuous operation with overload.

          3. Single point current share bus

            4. Typical schemes, at least with current mode control, are that one module will set the current share bus set point, others will follow. Considerations include protection against open / short circuit on the bus as a single point subsystem failure mode, low pass filtering of the current share signal to prevent transient instabilities, and turn-on/off initialization.

          4. Master – slave current share bus:
        2. Power Conversion or Switching Frequency Stability move up
          1. Introduction

            2. (Consider using as intro to 6.0)

            This application guideline intends to address the issues of power supply switching frequency stability as it relates to system level performance. It is intended to cover the major items of concern and provide guidance to the designer as to the applicability of CI elements. It is hoped that the designer consulting this guideline will avail himself/herself of all available knowledge about this subject matter and choose an appropriate module(s) that will provide the best overall system performance, considering all parameters (move to section 7.0). There are two basic types of switching converters, fixed and variable. Each one has its own merits and pitfalls. The consequences of the different schemes are far reaching, subsequently the designer must be aware of the methods and their effects at the system level. It should be noted that one method should not be favored over the other until all information is gathered, and examined with regard to the system level requirements. Additionally, the designer is urged to purchase and test several different types of modules, under realistic conditions that simulate the system installation, in order to verify actual performance.

            Generally, there are two basic methods of frequency control, fixed and variable. When considering a "stability" measurement, it is implied that there is a fixed parameter with some variance associated with it. Therefore, a "stability" cannot be associated with a variable frequency system, and one must use some other measurement, i.e. frequency range, deviation, etc.

          2. Fixed Frequency

            3. In this mode of operation, the switching frequency is designed to remain fixed, with some tolerance allowed for initial set-point accuracy and deviations from that set-point due to other effects. Typical items that will effect a change of frequency include temperature, humidity, aging, variable resistor drift, PWM IC discharge current, etc. Typically, switching power supplies operate at a fixed frequency between a few kHz and a few MHz. A typical tolerance of a commercially available module is +/- 10%, as published. However, under extreme operating conditions, worst case circuit analyses predict that deviations over life can approach +/- 50%. The designer is encouraged to inquire about any analyses that the vendor can supply in regard to the "stability" of the switching frequency since the data sheet may contain "typical" data, and not the worst case scenario.

          3. Variable Frequency

            4. Variable frequency operation is just that, variable. The switching frequency is changed dynamically during line and load changes such that a particular mode of operation is maintained. There are many topologies that utilize variable frequency to insure that switching action occurs at a precise time. For example, ZCS (zero current switching), and ZVS (zero voltage switching) may require that the frequency be altered such that the internal switches will only switch under the appropriate conditions. Therefore, you can expect the frequency to vary during operation when either a line change occurs, or a load change occurs. Under static operating conditions the frequency should remain relatively constant.

          4. The impact of switching frequency stability on EMI

      TBD move strikeout to EMI section

      All switching converters generate some form of EMI (Electro Magnetic Interference). Typically, the user will be concerned with conducted emissions on the input lines, noise on the output lines, and possibly radiated emissions from the module itself. Conducted emissions on the input (and output) lines are classified into common mode (CM), and differential mode (DM) noise. Common mode noise is typically generated by two methods, switching currents induced into the chassis, and radiation. Differential noise is generated by the conversion process, primarily caused by discontinuities of the input current waveforms to the main converter transformer. There can be large differences in EMI due to the switching topology chosen, and the method of frequency control. The designer is encouraged once again to solicit information from the vendor and obtain accurate plots of DM and CM noise on both the input and output terminals. The impact of frequency stability over line, load, temperature, and life should be considered.

      The fixed frequency converters tend to have higher CM and DM noise due to the relatively high dV/dT of the switching devices. However, this is not always the case since there are many variants of fixed frequency operation, including RTS (resonant transition switching, or "soft switching"), that may reduce the dV/dT considerably.

       

      Common mode noise is not well specified. See your EMI guy.

      Thermal issues

      Grounding issues

      Electrical Terminations (for components/PWAs/ Boxes)

      For component level elements these are typically either pins suitable for directly soldering in PWAs or insertion in connector sockets or terminals suitable for soldering wires to.

      For card / PWA level elements there is a wider variety of possible terminations, most common being some type of board mounted connector, usually for mating to a motherboard connector in a next higher assembly.

      For Box / LRU level assemblies these are usually some type of pins, lugs, bus bars, or enclosure mounted connector for mating to a cable assembly in the using system.

      Reverse Polarity Protection

      Ability of a Power Electronic Subsystem to withstand without damage the application of input and/or output power connections in reverse order. Usually implemented via either shunt or series protection devices. Shunt protection will typically present low impedance to the source, which may draw current sufficient to trip external protection devices, and series protection will typically present high impedance to the source approximating an open circuit.

      Sensing

    3. Supervisory Monitoring and Control and Software Implementation – David Cooper

In general, any power subsystem requires some form of control and monitoring. For a simple power subsystem, the monitoring may be integrated into the power conversion module itself, and no separate controller may be required. However in larger or more complex power subsystems the controller is usually implemented as a separate module within the subsystem.

 

Normally a hierarchical arrangement is used for control and monitoring:

 

The functions provided by the system controller will depend on the power subsystem specification and requirements, and may include some or all of the following:

Monitoring

-system output voltage(s)

-total system output current(s)

-battery status (if applicable)

-battery charge or discharge current

-temperature at one or more points in the system

-status/failure of modules

-status/failure of standby elements in redundant system

-environmental monitoring

-input voltage

-input current

 

Control

-adjust output voltage

-load current sharing between elements

-set protection levels for overcurrent

-set protection levels for over/under-voltage

-configure the power system by enabling/disabling elements

-remote reset of circuit breakers

-output power sequencing

-periodic testing of elements

-set protection level for over temperature

-remote on/off

 

User interface capabilities

-status of monitored data

-input parameters for control actions

-alarm signal to "outside world" (may be local or remote)

-remote user interface (RS232, modem, web access, etc)

-display information in a convenient and user-friendly manner

 

      1. Software - David Cooper

In power systems where a monitoring and/or control interface between elements is implemented using a datalink (such as RS232, CAN, …), then the software used must be fully taken into account during the system design and integration. This applies at all layers of the software, and if they are not fully compatible then one of two actions must be taken:

Because of the large number of possible datalink software implementations, no attempt is made in this document to recommend a single solution.Software Implementation – David Cooper

    1. EMC
    2. Physical Environment (Mechanicals) – shock, vibration, structural
    3. Adaptationccommodation

      4. The project determines responsibility for accommodation, either the system designer or the power subsystem developer.

      Accommodation can include:

      Physical Environment (Mechanicals) – shock, vibration, structural

      1. Electrical -
        1. Voltage and Current – Bryan Kellogg/ Wai Tam

          2. When a selected module’s input voltage range is insufficient to tolerate transients on the voltage source can be adapted by:

          MOV

        2. Protection– Bryan Kellogg/ Wai Tam

          3.  

        3. Supervisory control and monitoring – David Cooper

          4.  

        4. Stability - Harry Lamberth

          5.  

        5. EMC – Rich Buck/Ken Martindale

          6.  

          1. Lightening and Surge

            2.  

          2. ESD

           

        6. Electrical Bonding Resistance - George Kaelin/David Berry

          7.  

        7. Contact resistance - George Kaelin/David Berry

          8.  

        8. Isolation - George Kaelin/David Berry

          9.  

        9. Transients

          10.  

        10. Grounding issues - David Berry/George

          11.  

        11. Electrical Terminations (for components / PWAs / Assemblies)

          12. For component level elements these are typically either pins suitable for directly soldering in PWAs or insertion in connector sockets or terminals suitable for soldering wires to.

          For card / PWA level elements there is a wider variety of possible terminations, most common being some type of board mounted connector, usually for mating to a motherboard connector in a next higher assembly.

          For higher level assemblies such as LRUs these are usually some type of pins, lugs, bus bars, or enclosure mounted connector for mating to a cable assembly in the using system.

        12. Reverse Polarity Protection move to electrical interface definitions

          13. Ability of a Power Electronic Subsystem to withstand without damage the application of input and/or output power connections in reverse order. Usually implemented via either shunt or series protection devices. Shunt protection will typically present low impedance to the source, which may draw current sufficient to trip external protection devices, and series protection will typically present high impedance to the source approximating an open circuit.

        13. Sensing

          14.  

        14. Input

          15.  

          1. EMI

          Typically, the user will be concerned with conducted emissions on the input lines, noise on the output lines, and possibly radiated emissions from the module itself. Conducted emissions on the input (and output) lines are classified into common mode (CM), and differential mode (DM) noise. Common mode noise is typically generated by two methods, switching currents induced into the chassis, and radiation. Differential noise is generated by the conversion process, primarily caused by discontinuities of the input current waveforms to the main converter transformer.

          The fixed frequency converters tend to have higher CM and DM noise due to the relatively high dV/dT of the switching devices. However, this is not always the case since there are many variants of fixed frequency operation, including RTS (resonant transition switching, or "soft switching"), that may reduce the dV/dT considerably.

        15. Output - move to electrical adaptation

          16.  

          1. Output Noise

            2. If a variable frequency scheme is used, the output spikes will vary according to the frequency, and the designer should be aware of this. In certain platforms, particularily sensitive RF equipment, specific frequency bands must remain relatively quiet, in order to obtain maximum performance from the equipment. Therefore, the designer must balance the noise output versus the change in frequency expected in determining the applicability or suitability of specific modules.

          2. EMI

         

      2. Mechanical - George Kaelin
        1. Structural, structural adhesives, vibration

          2. ,

        2. Potting

          3.  

        3. Packaging

          4.  

        4. Thermal, thermal adhesives, heat sinks, heat exchangers, heaters and coolers

          5.  

          1. heat shielding

            2.  

          2. directing cooling air

           

        5. Shock Damping

         

      3. Environmental - Rick Eddins

        4.  

        1. Coating

          2.  

        2. Screen for temp range

          3.  

        3. Environmental Seals

          4.  

          Thermal issues are in mechanical section

        4. Vibration isolation and damping

         

      4. System Effectiveness - should have adaptation for the following or delete - Bruce Wright
        1. Reliability and Maintainability - Parallel for redundancy

          2.  

        2. Vendor Qualification - Are suppliers using a reasonable QA system

          3.  

        3. Parts Screening

          4.  

        4. Product Qualification

          5.  

        5. Dealing with product obsolescence, second sourcing,

          6.  

        6. Availability

          7.  

        7. Usability

          8.  

        8. Installability

          9.  

        9. Fault Tolerance, single point failures

          10.  

        10. Supportability

          11.  

        11. Economic

      Specify only to the actual requirements, the limits of the requirements may not be available in combination. System developer should consider alternatives to accommodate available products. Work with manufacturer to achieve accommodation. Select the minimum parameter set that satisfies the requirements. For the selected parameter set, specify only to the actual requirements. If the limits of the requirements are not available in combination, the system developer should consider alternatives to accommodate available products. Work with manufacturer to achieve accommodation.

    4. Case Studies, Examples

      5.  

      Verify that these are covered elsewhere

      1. heat shielding
      2. directing cooling air
      3. designing shock absorbers into the mounting
      4. transients
      5. Thermal issues
      6. Grounding issues - David Berry/George Kaelin move to electrical interface definitions
      7. Electrical Terminations (for components/PWAs/ Boxes) move to electrical interface definitions

        8. For component level elements these are typically either pins suitable for directly soldering in PWAs or insertion in connector sockets or terminals suitable for soldering wires to.

        For card / PWA level elements there is a wider variety of possible terminations, most common being some type of board mounted connector, usually for mating to a motherboard connector in a next higher assembly.

        For Box / LRU level assemblies these are usually some type of pins, lugs, bus bars, or enclosure mounted connector for mating to a cable assembly in the using system.

      8. Reverse Polarity Protection move to electrical interface definitions

        9. Ability of a Power Electronic Subsystem to withstand without damage the application of input and/or output power connections in reverse order. Usually implemented via either shunt or series protection devices. Shunt protection will typically present low impedance to the source, which may draw current sufficient to trip external protection devices, and series protection will typically present high impedance to the source approximating an open circuit.

      9. Sensing
      10. software/firmware
      11. others

       

      verify that this is covered 8.x Synchronization

    5. Input - move to electrical adaptation

      6. EMI

    6. Output - move to electrical adaptation
      2. Output Noise

        3.  

        Output noise is mainly classified into two categories, ripple and spikes. Output ripple is a function of many variables, but is primarily effected by output capacitance, output load and input voltage. It occurs at the fundamental or harmonic of the switching frequency, depending on the topology of the module. Spikes are actually switching transients, and occur when a switching element within the module changes states. Spikes are always at a higher frequency than the switching frequency, and are usually rich in harmonic content. Due to physical constraints, spikes are usually limited to 50 MHz, and contain little energy. However, they are relatively difficult to contain, since they radiate quite well and are of higher frequency than most devices used to reduce them. For example, the resonant frequency of a 1 uF ceramic capacitor, with ¼" leads, is less than 10 MHz, making it quite ineffective. Additionally, it is quite difficult to predict what the spike levels will be in the system until it is actually tested. Again, consideration should be given to the method of frequency control, since this will have an effect on the output noise. For example, If a variable frequency scheme is used, the output spikes will vary according to the frequency, and the designer should be aware of this. In certain platforms, particularily sensitive RF equipment, specific frequency bands must remain relatively quiet, in order to obtain maximum performance from the equipment. Therefore, the designer must balance the noise output versus the change in frequency expected in determining the applicability or suitability of specific modules.

      3. EMI

TBD consider moving to intro of this section

There are two basic types of switching converters, fixed and variable. Each one has its own merits and pitfalls. The consequences of the different schemes are far reaching, subsequently the designer must be aware of the methods and their effects at the system level. It should be noted that one method should not be favored over the other until all information is gathered, and examined with regard to the system level requirements. Additionally, the designer is urged to purchase and test several different types of modules, under realistic conditions that simulate the system installation, in order to verify actual performance.

 

ANNEX

  1. ANNEXES

PerformanceAnnex A1: Performance

(informative)

Parameters have been identified for each of the interfaces described in 3.1.4. For each parameter, performance ranges that are commercially available are indicated. Extraordinary requirements have been defined for many parameters. These are usually requirments for high reliability or harsh environment applications. This data has been compiled into tables TBD in Annex 7.1

 

TBD add paragraph to reference tables

Electrical Performance.

The electrical interface is bounded by the input voltage and the output voltage. There may be control signals or test points which need to be addressed. There can be various configurations within this boundary whose internal interfaces are unknown. Several "building blocks" can be connected together with one blocks’ output connected to the next blocks’ input. Blocks may be components or cards. Table 1, Table 2 and Table 3 describe electrical performance.

 

NOTE: Commonly Available = Capability: Extraordinary Requirements = Requirements discussion about changing headers

 

Table 1 General Interface GeneralENERAL ElectricalLECTRICAL InterfaceNTERFACE Performance

Interface Parameter

Commonly Available

Extraordinary Requirements
  1. Bonding resistance to chassis

Safety Agency Approvals

EMI, Electrical performance

Reference MIL-STD B5087 5400 1399

Manufacturer’s specifications

  
  • Contact Resistance
    		•

    Vibration, dissimilar metals, current rating, specify

    		  
  • ESD
    		•   

    Process controls and packaging (ref ANSI625)
  • Isolation
    		•

    Characterization data needed – define what’s isolated and the dc isolation voltage.

    Input to chassis, output to chassis, input to output. Voltage/resistance as required
  • Supervisory Monitoring
  • Supervisory Control (includes BIT)

    •  

    Power supply status signals Vendor to characterize:

    Overload, overvoltage, over-temperature, and, input undervoltage failures.

    Power on Reset "power good signal"

    Fan failure, breaker tripped

    All usually required plus

    Input Power good indicator, Elapsed Time sufficient

    IEEE 1149.1, 1553, RS232

     

    Table 2 Electrical Interface: Output/Load Performance

    Interface Parameter

    Commonly Available

    Extraordinary Requirements
    1. Nominal dc output voltage (Vdc)

    1.5, 2.1, 2.5, 2.8, 3.3, 5, +/-5,

    8, +/-12, +/-15, 24, 28,

    36, 48, 54

    Nominal Range 0.8 – 50Vdc (digital & low level analog)
  • Regulation, Load (min to full load)
    		•

    Single or Main output: 0.02% to 1% Static variation about the set point

    Secondary output: 5% – 10%

    TBD
  • Regulation, Line
    		•

    Single or Main output: 0.02% - 0.5%

    Secondary output: 1% –5%

    TBD
  • Regulation, Temperature (drift over rated temperature range)
    		•

    0.005 – 0.02% / ° C

    TBD
  • Regulation, Combined
    		•

    3%

    1% for < 5V

    1% - 10% for > 5V

    which method RSS or extreme value
  • Regulation effects due to aging
    		•

    0.02% / 1000hrs

    TBD
  • Set point voltage accuracy
    		•

    0.5% to 1%

    TBD
  • Output Voltage Trim Range
    		•

    -50% to +10% when available (usually single output only)

    TBD
  • Power Density Range
    		•

    Varies widely based on system architecture

    TBD
  • Voltage Ripple

    • 1% p-p Vout 5V to 50V @ switching frequency

    2% p-p Vout <5V @ switching frequency

    BW<20 MHz, at specified conditions

    BW<100 MHz
  • Voltage Spikes
    		•

    1% p-p Vout 5V to 50V

    2% p-p Vout <5V

    BW<20 MHz, at specified conditions

    TBD
  • Switching frequency Stability
    		•

    For fixed frequency switching topologies, the operating frequency is typically +/-10% of the initial set point.

    For variable frequency switching converters, the operating frequency can vary depending on line and load conditions.

    TBD
  • Synchronization
    		•

    Vendor specifies availability and interface

    TBD
  • Noise spectrum – EMI
    		•

    TBD

    As required (ref MIL-STD 461)
  • Voltage Programming

    • Vendor specifies availability and interface

    Analog trim pin

    On/Off control

    Serial interface

    TBD
  • Over voltage Protection
    		•

    Vendor specifies availability, trip point, and characteristics

    Should be sufficient to protect power supply and provide access for shutdown. [Need shutdown access because BIT circuitry needed anyway ® many times external circuitry used to perform this function]
  • Low Voltage Protection
    		•

    TBD

    Indication sometimes required
  • Over current characteristics

    • Short circuit response

    Straight line

    Foldback

    Cyclic

    Trip point and tolerance – 104% (defines max operating current) to 125%

    Characterize voltage recovery characteristics

    Withstand indefinite overload or short circuit

    Indication may be required.
  • Hold up time
    		•

    Vendor needs to specify availability and time

    Up to several seconds may be required

    Up to 200ms is common
  • Start up Trajectory
    		•

    Vendor needs to provide response characteristic. TBD

    Turn on time (20 – 100ms), overshoot

  • Power up voltage sequence
    		•   

    Often required for multiple outputs
  • Shutdown sequence
    		•   

    Often required for multiple outputs
  • Load dynamics

    • Max di/dt - 0.5A/usec to 30 A/usec

    Steploads - TBD

    Steploads - Vendor to specify voltage deviation and settling time. Per IEEE P1515
  • Over-temp Shutdown

    • Over-temp due to short circuit

    Available – characterize when available

    Characterize voltage recovery characteristics

    Sometimes required
  • Load Impedance Safe Operating Area TBD
    		•

    TBD Building Code – Different for each P.S. Design – best approach might be to define a criteria

    Reactance, max capacitance,
  • Output impedance
    		•   

    If a (-)R is present, output impedance needs to be characterized.
  • Current sharing: Multiple Modules Capacity vs. Redundancy
    		•

    Sometimes available TBD

     

     

    need to know the following:

    current sharing tolerance: 2 – 10%

    current sharing stability characterization

    response to output short characterization

    response to control bus failure characterization

    capacity vs. redundancy
  • Loop stability

    • TBD

    Zout, Zload, Zin

    Gain and phase margin

     

    Table 3 Electrical Interface Source Performance

    Interface Parameter

    Commonly Available

    Extraordinary Requirements
    1. Source Power

    48Vdc nom (36 – 75Vdc)

    24Vdc nom (18 – 36Vdc)

    300Vdc nom (180 - 375 V dc)

     

    85V - 264V ac or dc, Universal Input, single phase

    120/240Vac nom (90 – 132 / 180 – 264 V ac, (50 Hz, 60 Hz,))

    28Vdc, 270Vdc,

    115/200 Vac (400 Hz) per (MIL-STD 704, RTCA DO 160C,)

     

    Backplane voltages 10Vdc, 48Vdc

     

     
  • EMC (Electro-Magnetic Compatibility)
    		•

    VDE, UL, CSA, TUV, CE, BABT, FCC

    MIL-STDs 461, 462, RTCA-DO160C, VDE, FCC

    NOTE: HIRF (Highly Intensified RF) – No building code is needed…. Module testing does not provide good insight into system performance.

    Following characterization data is needed:

    EMI:

    Conducted Emissions – 50 kHz to 50 Mhz

    Conducted Susceptibility – 30 Hz to 50 kHz

    Radiated Emissions – TBD

    Radiated Susceptibility – TBD

    {Issue with "radiated parameters" is… will the cost of this test provide value? – can bench test provide data to enable integration success}

    Magnetic fields – No building code needed…too specialized
  • Power Factor (Harmonic content, loss of 1phase, 3rd harmonic distortion, 3 phase – I/V balance, frequency) TBD
    		•

    VDE, IEC61000,

    Power Factor correction is not commonly available for 3 phase systems

    Boeing requirement, MIL-STD 704, 461
  • Inrush Current Profile
    		•

    Vendor Characterization

    X times max steady state

    i2t limit for < 1ms
  • Leakage current to chassis
    		•

    VDE, UL, CSA, TUV, CE,

    MIL-STD 461
  • Reflected Ripple Current p-p
    		•

    <10% of Iin @ switching frequency

    MIL-STD 461
  • Undervoltage protection (shutdown & recovery characteristics)
    		•

    ac – ac fail alarm then shutdown

    dc – Some have undervoltage lockout

    Needs to operate 0 to max Vin with no damage

    Characteristics must define – Vout response from 0 to Vin, max.
  • Source Impedance as a function of frequency
    		•   

    May be required
  • Reverse Polarity Protection
    		•

    Characterize if Available

    Sometimes required
  • Input Impedance as a function of frequency TBD
    		•

    TBD Building Code – Different for each Power Supply Design – best approach might be to define a criteria

    		  
  • Three phase – phase rotation insensitivity

    • Vendor characterize if issue

         		 

     

    Mechanical Interface

    The mechanical interface includes size, mounting methods, thermal requirements, external connections, etc. Mechanical Performance is shown in Table 4.

    Table 4 Mechanical Interface Performance

    Interface Parameter

    Commonly Available

    Extraordinary Requirements
    1. Thermal Management

    The following applicable parameters shall be supplied at no load, half load, and full load

    		  
    1. Thermal Interface

    NA

    NA
    1. Conduction Cooling
      1. Flatness
      2. Maximum baseplate temperature
      3. Thermal Dissipation Area

     

    Thermal I/F flatness – characterization 0.01in/in typical

    Characterize maximum operating baseplate temperature ( 100 ° C ) at full power

     

     

    Characterize in in2 or cm2

    Power dissipation at max temp and full load

    Baseplate temp vs. power curve

    Characterize max operating baseplate temperature at full given power and given environment

     

     

    Total Indicator Runout as required

    Characterize in cmin2
  • Convection Cooling
    1. Airflow

      2.  

    2. Pressure drop/

      3. back pressure

       

       

    3. Temp rise
    4. Max Inlet temp

     

    Airflow – characterization Linear Feet / Min. at STP

     

    Pressure drop – characterize in. of H2O difference between inlet and outlet function of flow rate

    Back press. – characterize source pressure = outlet pressure + pressure loss function of flow rate

     

    Characterize in ° C

    Characterize in ° C

     

    Airflow – mass flow rate (at altitude)

    Specify inlet and outlet temperature and flow rate or pressure drop
  • Liquid Cooling (Pipe)
    1. Flow rate
    2. Pressure drop

      3.  

    3. Temp rise
    4. Max inlet tem
    5. Cooling medium

     

     

     

    Characterize in liters/hr

    Characterize inches of H2O difference between inlet and outlet

    Characterize in ° C

    Characterize in ° C

    Liquid requirement – characterization of: flow rate (liters/hr), type, MSDS, fitting interface, max inlet temperature
  • Maximum Power dissipation

    • Vendor to provide efficiency so that Maximum power dissipation can be calculated for module (refer to efficiency in electrical table)

    Maximum expected dissipation for system
  • Physical characteristics of a system
    		•

    NA

    NA
    1. Component (may be on a "PC board")
    		    
    1. Configuration

    0.375" to 0.5" height is near minimum

    Typical brick ( 4.6"x2.3"x0.5"), half brick (2.3"x2.3"x0.5"), quarter brick: (2.28"x1.45"x0.5"); other sizes are available

    JEDEC power supply components

    Provide environment compatible with component requirements such as: cooling, EMI, vibration, and other considerations herein defined.

  • Mounting

    • Follow manufacturers recommendations such as torque requirements, adhesives, soldering etc

    Follow recommendations
  • Card/PWA Level

    • VME-6U, 3U, SEM(Standard Electronic Mod), Standard Aerospace Module(SAM), PCMCIA, ISA, and others

    Define a compatible PWA
  • Electrical Connection
    		•

    NA

    NA
    1. Component pin outs. Note move to electrical connection

    Specify location and function

    User must define a compatible interface

  • Electrical Terminations (for components/PWAs/ assemblies)
    		•

    Specify location and function

    Pin/lugs/terminal block, flying leads, connectors

    Connector keying

    User must define a compatible interface

    Testability access

    Connector keying
  • Durability
    		•

    NA environmental, sockets not used

    Specify plating

    Solderability, corrosion

    Number of Insertions, Insertion/extraction force
  • Solderability

    • Solder temperature and time.

    Must comply
  • Weight/Dimensions
    		•

    Characterize weight (lbs., kg,), overall dimensions

    Minimize weight for aircraft, volume (in3, cc)
  • Package Characteristics
    		•

    Safety certifications such as CE

    Flammability UL V94-0

    Characterize case material/packaging material- ex. Out-gassing

    Characterize Product Marking – durability

    Characterize Case emissivity

    Hazardous materials statement
  • Center of gravity

    • Not Normally Available

    May be required

     

    Environmental Interface Performance

    There are several conditions to consider for environmental Performance. The operating and non-operating environments have to be defined. There may be several different environments within one platform such as wing pylons vs. cockpits of fighter aircraft. Performance may also be life expectancy oriented or simply robustness indicators. Table 5 contains environmental Performance.

     

    Table 5 Environmental Interface Performance

    Interface Parameter

    Commonly Available

    Extraordinary Requirements
     

    General Note. Make distinction between – non-operating and operating

         		 
    1. Storage Temperature Range

    TBD

    TBD
  • Operating Temperature Range
    1. Component level

      2.  

    2. Module Level
    3. Assembly level

     

     

    0 to 70 ° C – Commercial, -40 to 85 ° C - Industrial (component level)

    -40 to 100 ° C (module level)

    -20 to 85 ° C (assembly level)

    Specify thermal interface Baseplate or ambient temp

    -XX (55) to +XXX (125) ° C known aircraft apps, free airflow, worst case environment- pylon, wing, operational/standby, storage higher. (Consider alternatives or relaxation of specification for CI applications)

    RTCA DO-160C, D

    Basis for operating temperature range defined (qualification test, ATP, etc.)
  • Shock and Vibration (could have more impact on power supply systems)
    		•

    Usually not stated

    Dictated by system design requirements or tailored MIL STDs.

    Designer to characterize or specify level and method.

    Define ATP (Acceptance Test Plan) to include ESS (Environmental Stress Screening) and other test procedures as required.

    Test, analyze, and fix in development and qualification phases.

    Acceptance test procedures for production.
  • Humidity (combined environments)
    		•

    0 to 95%, non-condensing

    Dictated by system design requirements or tailored MIL STDs.

    Test, analyze, and fix in development and qualification phases.
  • Resistance to materials (jet fuel, hydraulic fluid, de-icer, gases, corrosive agents)
    		•

    As required by safety agencies, CE, UL, TUV, VDE, etc.

    Dictated by system design requirements or tailored MIL STDs.

    Test, analyze, and fix in development and qualification phases.
  • Salt-spray
    		•

    Usually not stated

    Dictated by system design requirements or tailored MIL STDs.

    Test, analyze, and fix in development and qualification phases.
  • Altitude – out-gassing/decompression/ corona
    		•

    Up to and including 10,000 feet.

    Dictated by system design requirements or tailored MIL STDs.

    Test, analyze, and fix in development and qualification phases.
  • Fungus
    		•

    Usually not stated

    Dictated by system design requirements or tailored MIL STDs.

    Test, analyze, and fix in development and qualification phases.
  • Sand and dust
    		•

    Usually not stated

    Dictated by system design requirements or tailored MIL STDs.

    Test, analyze, and fix in development and qualification phases.
  • Explosive atmosphere
    		•

    As required by safety agencies, CE, UL, TUV, VDE, etc.

    Dictated by system design requirements or tailored MIL STDs.

    Test, analyze, and fix in development and qualification phases.
  • Thermal shock/Thermal cycling
    		•

    May be available in different product grades.

    Dictated by system design requirements or tailored MIL STDs.

    Designer to characterize or specify level and method.

    Define ATP (Acceptance Test Plan) to include ESS (Environmental Stress Screening) and other test procedures as required.

    Test, analyze, and fix in development and qualification phases.

    Acceptance test procedures for production.
  • Combined effects (Many Environments @ once)
    		•

    Usually not stated

    Dictated by system design requirements or tailored MIL STDs.

    Designer to characterize or specify level and method.

    Define ATP (Acceptance Test Plan) to include ESS (Environmental Stress Screening) and other test procedures as required.

    Test, analyze, and fix in development and qualification phases.

    Acceptance test procedures for production
  • Acoustic Susceptibility
    		•

    Usually not stated

    Dictated by system design requirements or tailored MIL STDs.

    Test, analyze, and fix in development and qualification phases.
  • Acoustic Emissions/ audible noise.
    		•

    Usually not stated

    Dictated by system design requirements or tailored MIL STDs.

    Designer to characterize or specify level and method.

    Define ATP (Acceptance Test Plan) to include ESS (Environmental Stress Screening) and other test procedures as required.

    Test, analyze, and fix in development and qualification phases.

    Acceptance test procedures for production

    *May be required for each production unit
  • Radiation

    • Usually not stated

    Dictated by system design requirements or tailored MIL STDs.

    Test, analyze, and fix in development and qualification phases.

     

     

     

    System Effectiveness Performance

    System Effectiveness Performance is concerned with reliability and maintainability. Table 6 contains System Effectiveness Performance.

    Table 6 System Effectiveness Interface Performance

    Interface Parameter

    Commonly Available

    Extraordinary Requirements
    1. Reliability – MTBF

    When available, calculated or demonstrated per Mil-Std 217 as requested.

    Dictated by system requirements or Mil-Std 217.

    Physics of failure models.
  • Maintainability
    		•

    Repair or replace

    Characterize throw away vs. repair method and repair cost.
  • Compliance Information, e.g., Agency Approvals
    		•

    Identify compliance and agency approvals ex FCC Part 15, BABT, UL, CSA, VDE

    		  
  • Product Life (Maintenance items, short life components)
  • Maintenance Service Interval
    		•

    Not Available

    Awareness of limited life components
  • Component Quality
    		•

    Delete

    		  
  • Derating
    		•

    Vendor recommendation available

    Negotiated

  • Quality Control
    		•

    Process control methods and certifications disclosed

    (ISO Registration, SPC, screening, ATP)

    Process control methods, results, and certifications disclosed
  • Configuration Management

    • ‘Specifications are subject to change without notice" is typical

    Change notification

    Latent defect notification
  • Warranties
    		•

    As stated

    As specified per contract requirements
  • Test Equipment Calibration and Standards
    		•

    Per process control

    Required
  • Product Obsolescence
    		•

    Disclosure when no longer available

    Obsolescence mitigation plan
  • Qualification Process

    • Per process control

    Qualification test report

    Test to standard (P1515)
  • Production line final test
    		•

    Testing Process details and data. As specified.

    Required
  • Acceptance Testing

    • Not Expected NOTE: Under discussion

    Required

    Annex 2Annex B: Parameter Index

    (informative)

    Table 7 General System Electrical Interface Parameters

    Parameters

    Where Defined

    Bonding resistance to chassis

    Per P1515, 4.9.3 (UUT Grounding)

    Contact Resistance

    		  

    ESD

    		  

    Isolation

    Per P1515, 4.9.2 (Input- Output Isolation Resistance)

    Status Monitoring vs. BIT

    TBD BIT per P1515

    Table 8 Electrical Output/Load System Interface

    Nominal dc output voltage (Vdc)

    Per P1515, 3.8 (DC Signal). Measurement similar to P1515, 4.1.1 (DC Input Voltage) except taken at UUT output.

    Regulation, Load (min to full load)

    Per P1515, 4.4.2 (Load Regulation).

    Regulation, Line

    Per P1515, 4.4.1 (Line Regulation).

    Regulation, Temperature (drift over rated temperature range)

    Per P1515, 4.4.3 (Temperature Regulation).

    Regulation, Combined

    		  

    Regulation effects due to aging

    		 

    Set point voltage accuracy

    		  

    Output Voltage Trim Range

    Per P1515, 4.14.2 (Voltage Trim).

    Power Density

    		  

    Voltage Ripple

    Per P1515, 4.5.1 (Output Voltage Ripple).

    Voltage Spikes

    Per P1515, 4.5.3 (Switching Spikes) and 3.43 (Transient).

    Switching frequency Stability

    		 

    Synchronization

    		  

    Noise spectrum – EMI

    		 

    Voltage Programming

    Per P1515, 4.14.3 (Remote Programming).

    Overvoltage Protection

    Per P1515, 4.15.2 (Overvoltage Response).

    Low Voltage Protection

    		  

    Overcurrent characteristics

    		  

    Short circuit response

    Per P1515, 3.38 (Short Circuit) and 4.15.4 (Overcurrent and Short-Circuit Current Protection).

    Hold up time

    Per P1515, 4.6.1 (Hold up Time).

    Start up Trajectory

    Per P1515, 4.6.2 (DC Source Inrush Current).

    Power up voltage sequence

    Per P1515, 4.8.1 (Start-up Sequencing/Remote On/Off Control).

    Shutdown sequence

    Per P1515, 4.8.2 (Turn-Off Sequencing/Remote On/Off Control).

    Load dynamics

    Per P1515, 4.4.7 (Dynamic Load Regulation).

    Overtemperature Shutdown

    		  

    Overtemperature due to short circuit

    Per P1515, 3.27 (Overtemperature Protection) and 4.15.4 (Overcurrent and Short-Circuit Current Protection).

    Load Impedance Safe Operating Area

    Per P1515, 3.22 (Load Impedance) and 4.4.2 (Load Voltage Regulation).

    Output impedance

    Per P1515, 4.7.2 (Output Impedance).

    Current sharing: Multiple Modules Capacity vs Redundancy

    Per P1515, 4.13 (Use of Multiple Power Supplies in a System).

    Loop stability

    Per P1515 3.23 (Loop Stability).

     

    Table 9 Electrical Source System Interface Parameters

    Source Power

    Per P1515, 3.48 (Vnom Input) plus a number of input parameters describing AC and DC source power.

    EMC (Electro-Magnetic Compatibility)

    Per P1515, 3.13 (EMC)

    Power Factor (Harmonic content, loss of 1 phase, 3rd harmonic distortion, 3 phase – I/V balance, frequency)

    Per P1515, 3.34 (Power Factor (Displacement)), 3.35 (Power Factor (Distortion)), 3.36 (Power Factor (True))

    Inrush Current Profile

    Per P1515, 4.6.2 (DC Source Inrush Current).

    Leakage current to chassis

    Per P1515, 4.9.1 (AC Leakage Current), 4.9.2 (Input-Output Isolation Resistance).

    Reflected Ripple Current p-p

    Per P1515, 4.5.4 (Input Induced Ripple Current).

    Undervoltage protection (shutdown & recovery characteristics)

    Per P1515, 4.15.3 (Output Undervoltage/Overvoltage Indication).

    Source Impedance as a function of frequency

    Per P1515, 4.7.3 (Input Impedance).

    Reverse Polarity Protection

    		 

    Input Impedance as a function of frequency

    Per P1515, 4.7.3 (Input Impedance).

    Three phase – phase rotation insensitivity

    Per P1515, 4.2.6 (Phase Sequence).

    Mechanical System Interface Parameters

    		  

    Thermal Management

    		  

    Thermal Interface Type – simple definition of type

    		  

    Cooling Provision

    Per P1515, 5.4.7 (Cooling Requirements).

    Conduction Cooling

    		  

    Flatness

    Per P1515, 5.4.8 (Baseplate Flatness).

    Maximum baseplate temperature

    Similar to P1515, 3.24 (Operating Temperature)

    Thermal Dissipation Area

    May be similar to P1515, 5.4.2 (Footprint) if thermal dissipation area is same as footprint for a part.

    Convection Cooling

    		  

    Airflow

    		  

    Pressure drop/back pressure

    		  

    Temp rise

    		  

    Max Inlet temp

    		  

    Liquid Cooling (Pipe)

    		  

    Flow rate

    		  

    Pressure drop

    		  

    Temp rise

    		  

    Max inlet temp

    		  

    Cooling medium

    		  

    Maximum Power Dissipation

    		  

    Packaging

    		  

    Component (may be on a "PC board")

    		  

    Configuration

    Per P1515, 5.4.3 (Envelope Dimension) and 5.4.2 (Footprint).

    Mounting

    Per P1515 5.4.4 (Mounting Orientation) and 5.4.10 (Layout) and 5.4.11 (Installation Methods).

    Card/PWA Level

    		  

    Electrical Connection

    Per P1515, 5.4.5 (Connection Types) and 5.4.6 (Connection Locations).

    Component pin outs.

    Per P1515, 5.4.1 (Pin-out).

    Electrical Terminations (for components/PWAs/ assemblies)

    		  

    Durability

    Per P1515, 5.3.5 (Mechanical Shock and 5.3.6 (Vibration).

    Solderability

    Per P1515, 5.4.11 (Installation Methods).

    Weight/Dimensions

    Per P1515, 5.4.3 (Envelope Dimension) and 5.4.2 (Footprint).

    Package Characteristics

    		 

    Center of gravity

    		  

    Table 10 Environment System Interface Parameters

    Storage Temperature Range

    Per P1515, 5.3.12 (Storage Temperature).

    Operating Temperature Range

    Per P1515, 5.3.9 (Operating Temperature).

    Shock and Vibration (could have more impact on power supply systems)

    Per P1515, 5.3.5 (Mechanical Shock) and 5.3.6 (Vibration).

    Humidity (combined environments.)

    Per P1515, 5.3.1 (Humidity).

    Resistance to materials (jet fuel, hydraulic fluid, de-icer, gases, corrosive agents)

    		  

    Salt-spray

    Per P1515, 5.3.3 (Salt Fog).

    Altitude – out-gassing/decompression/ corona

    Per P1515, 5.3.4 (Storage Altitude) and 5.3.7 (Outgassing).

    Fungus

    Per P1515, 5.3.14 (Fungus).

    Sand and dust

    		  

    Explosive atmosphere

    		  

    Thermal shock/Thermal cycling

    Per P1515, 5.3.8 (Thermal Shock) and 5.3.10 (Temperature (Thermal) Cycling).

    Combined effects (Many Environments @ once)

    		  

    Acoustic Susceptibility

    		  

    Acoustic Emissions/ audible noise.

    		  

    Radiation

    		  

    Table 11 System Effectiveness Interface Parameters

    Compliance Information, e.g., Agency Approvals

    		 

    Product Life

    		  

    Component Quality

    		  

    Derating

    		  

    Quality Control

    		  

    Configuration Management

    		  

    Warranties

    		  

    Test Equipment Calibration and Standards

    		 

    Product Obsolescence

    		  

    Qualification Process

    		 

    Production line final test – testing the production line.

    		  

    First Article Test -

    		 

    Acceptance Testing(each unit

    		  

    Reliability – MTBF

    Per P1515, 5.1.3 (MTBF).

    Maintainability

    Per P1515, 5.2.1 (Maintainability).

     

     

    Table 12 Mechanical Interface Performance

    Thermal Management

    		  

    Thermal Interface

    		 

    Conduction Cooling

    Flatness

    Maximum baseplate temperature

    Thermal Dissipation Area

    		  

    Convection Cooling

    Airflow

     

    Pressure drop/

    back pressure

     

     

    Temp rise

    Max Inlet temp

    		  

    Liquid Cooling (Pipe)

    Flow rate

    Pressure drop

     

    Temp rise

    Max inlet tem

    Cooling medium

    		  

    Maximum Power dissipation

    		  

    Physical characteristics of a system

    		  

    Component (may be on a "PC board")

    		  

    Configuration

    		  

    Mounting

    per 1515 5.4.4 (Mounting Orientation), 5.4.10 (Layout), 5.4.11 (Installation Methods)

    Card/PWA Level

    		  

    Electrical Connection

    Per 1515 5.4.5 (Connection Types), 5.4.6 (Connection Location)

    Component pin outs. Note move to electrical connection

    Per 1515 5.4.1 (Pin-out)

    Electrical Terminations (for components/PWAs/ assemblies)

    		  

    Durability

    Per 1515 5.3.5 (Mechanical Shock), 5.3.6 Vibration)

    Solderability

    Per 1515 5.4.11 (Installation Methods)

    Weight/Dimensions

    Per 1515 5.4.3 (Envelope Dimension), 5.4.2 Footprint

    Package Characteristics

    		  

    Center of gravity

    		  

     

    New Parameters

    System Effectiveness

     

    Electrical

     

    Mechanical

    -

     

    Environmental

    -

     

     

    Scrap; Notes:

    Is all this covered?

    The Recommended Practice provides guidance in performance of the following functions:

     

      1. Provides parameter guidelines
      2. Provides overall system boundaries consistent with available products, as defined herein

     

      1. Provides achievable power subsystem parameters
      2. Lists available elements
      3. Application guidance facilitating the use of available items
      4. May provide test methodologies for subsystems

     

      1. Provides a standard format for reporting product performance
      2. Guideline to understand system developer requirements

     

     

     

    (Save for presentation materials

    Providers of power electronics can reference this document to publish expanded standardized data. Integrators of special applications can use this data to select CIPE products, thus promoting use of CIPE. )

    System Element and Architecture Definition

    Identification of Power

    loads, sources, converters, filters, cards,

    Physical Elements are items such as cards, LRU/LRM/SRUs, and items used to construct an electronic subsystem

    (TBD) Logical Elements such as loads, filters, sources, converters, and other functional entities, used in the design of power subsystem architecture

     

    From Output Noise

    Output noise is mainly classified into two categories, ripple and spikes. Output ripple is a function of many variables, but is primarily effected by output capacitance, output load and input voltage. It occurs at the fundamental or harmonic of the switching frequency, depending on the topology of the module. Spikes are actually switching transients, and occur when a switching element within the module changes states. Spikes are always at a higher frequency than the switching frequency, and are usually rich in harmonic content. Due to physical constraints, spikes are usually limited to 50 MHz, and contain little energy. However, they are relatively difficult to contain, since they radiate quite well and are of higher frequency than most devices used to reduce them. For example, the resonant frequency of a 1 uF ceramic capacitor, with ¼" leads, is less than 10 MHz, making it quite ineffective. Additionally, it is quite difficult to predict what the spike levels will be in the system until it is actually tested. Again, consideration should be given to the method of frequency control, since this will have an effect on the output noise. For example,

     

    Figure Mapping Extraordinary Requirements to commonly available interface requirements Add "Interface" to each arrow Put in Sect 7.1