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You are right that the nAUI chip to chip specification methodology in draft 1.1 can be leveraged to build retimed modules. It just requires writing a chip to module specification somewhere which specifies test points at the modules pins. The presentation you sent is an excellent starting point for this and a lot of the XFI interface specifications can be leveraged in writing the nAUI chip to module specifications.
Best Wishes for the New Year to Everyone
From: Ryan Latchman [mailto:Ryan.Latchman@xxxxxxxxxx]
Hi Ali, Chris,
This is an important discussion which needs to get resolved quickly.
I would like to ensure that XLAUI / CAUI maintains its broad market applicability as a simple retimed interface. I don’t think the current specification methodology prevents it from being leveraged to build retimed modules. I’ve put together the attached material to show how retimed interfaces were specified in the past (namely XFI). In XFI, you’ll notice that the Before Connector and After Connector specs are similar. 40/100GbE modules may have an analogous situation, depending on their size and electrical characteristics.
If we need to change the XLAUI / CAUI specification, we need solid contributions on what needs to change.
From: Ali Ghiasi [mailto:aghiasi@xxxxxxxxxxxx]