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A number of individuals have been discussing this issue. Chris has noted that Ryan’s presentation is an excellent starting point in writing a nAUI chip to module specification.
I want to re-iterate what has been said repeatedly throughout this project and in the call for presentations –
As a reminder to the group, we are a contribution driven organization, and we do have a fairly large project underway. It should not be assumed by anyone that work will just get done without contributions to drive it. Areas not moving forward will be brought to the attention of the Task Force for consideration on how to address; as such issues can not be allowed to threaten the overall project schedule.
Those individuals who want to see proposed changes to Annex 83A need to bring a proposal forward with proposed changes to Annex 83A. As a reminder to all, the TF voted and approved the TF schedule. This schedule has us going to WG ballot in March, which means we need to close out all TBDs at this meeting.
From: Chris Cole [mailto:chris.cole@xxxxxxxxxxx]
You are right that the nAUI chip to chip specification methodology in draft 1.1 can be leveraged to build retimed modules. It just requires writing a chip to module specification somewhere which specifies test points at the modules pins. The presentation you sent is an excellent starting point for this and a lot of the XFI interface specifications can be leveraged in writing the nAUI chip to module specifications.
Best Wishes for the New Year to Everyone
Hi Ali, Chris,
This is an important discussion which needs to get resolved quickly.
I would like to ensure that XLAUI / CAUI maintains its broad market applicability as a simple retimed interface. I don’t think the current specification methodology prevents it from being leveraged to build retimed modules. I’ve put together the attached material to show how retimed interfaces were specified in the past (namely XFI). In XFI, you’ll notice that the Before Connector and After Connector specs are similar. 40/100GbE modules may have an analogous situation, depending on their size and electrical characteristics.
If we need to change the XLAUI / CAUI specification, we need solid contributions on what needs to change.
From: Ali Ghiasi [mailto:aghiasi@xxxxxxxxxxxx]