Re: Potential heating problem with standard patch Cat5 panels
I suggest that in "Informative Annex" discussing the requirements on trace
thickness and current carrying capacity should be added to the draft. Such
an annex would help potential suppliers and purchasers of equipment to be
used in conjunction with 802.3af.
Robert D. Love
Chair, Resilient Packet Ring Alliance
President, LAN Connect Consultants
7105 Leveret Circle Raleigh, NC 27615
Phone: 919 848-6773 Mobile: 919 810-7816
email: rdlove@xxxxxxxx Fax: 720 222-0900
----- Original Message -----
From: "DOVE,DANIEL J (HP-Roseville,ex1)" <dan_dove@xxxxxx>
Sent: Friday, May 04, 2001 5:04 PM
Subject: RE: Potential heating problem with standard patch Cat5 panels
> Hi Rick,
> Depending on PC board thickness, dielectrics, and the possible
> presence of ground planes, it is possible that someone might have
> built a patch panel with traces as small as 4-5 mils.
> Since there has traditionally not been a mandate to support 350mA
> of current, this is not a spec violation and constitutes a dilemma.
> At a minimum, we should try to determine the installed base of
> patch panels and their characteristics to ensure that exposure
> (for the general industry) is low. Does someone have market-share
> data / technical data for such things?
> Dan Dove
> -----Original Message-----
> From: Rick Brooks [mailto:ribrooks@xxxxxxxxxxxxxxxxxx]
> patch panels are being damaged, there must be a whole lot more current
> involved than 350ma,
> or the traces are very thin, or it has a different cause.